• Intel® Xeon® W-2100 Processors, Intel® Xeon® W-2200 Processors, Single Socket LGA-2066 (Socket R4) supported, CPU TDP support Up to 165W TDP

• Intel® C422

• Up to 512GB ECC RDIMM, DDR4-2933MHz; Up to 1TB Registered ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots

• 3 PCI-E 3.0 x8,
1 PCI-E 3.0 x16,
1 PCI-E 3.0 x8 (in x16 slot),
1 PCI-E 3.0 x4 (in x8 slot)
M.2 Interface: 1 PCI-E 3.0 x4
M.2 Form Factor: 2280/22110
M.2 Key: M-Key
Double Height Connector

• Dual LAN with Intel® i210 Gigabit Ethernet Controller

• Intel® C422 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10

• Intel® Xeon® W-2100 Processors, Intel® Xeon® W-2200 Processors, Single Socket LGA-2066 (Socket R4) supported, CPU TDP support Up to 165W TDP

• Intel® C422

• Up to 256GB ECC RDIMM, DDR4-2933MHz; Up to 512GB ECC LRDIMM, DDR4-2933MHz, in 4 DIMM slots

• Dual LAN with Intel® i210 Gigabit Ethernet Controller

• 1 PCI-E 3.0 x16 (in x16) slot

• 2 PCI-E 3.0 NVMe x4 Internal Port(s), 1 in hybrid mode (NVMe/4x SATA)

• Intel® C422 controller for 4 SATA3 (6 Gbps) ports (via onboard OCuLink); RAID 0,1,5,10

• Supports 12V DC power input

• 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP

• Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots

• Intel® C622 chipset

• Expansion slots:
1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x32 Left Riser slot

• 2 10GbE LAN ports

• 10 SATA3 (6Gbps) via C622

• I/O: 1 VGA, 2 COM, TPM header

• 2 SuperDOM with built-in power

• M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M-Key
Double Height Connector

• 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP

• Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots

• Intel® C622 chipset

• Expansion slots:
1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x32 Left Riser slot

• 4 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10

• 2 10GbE LAN ports

• 10 SATA3 (6Gbps) via C622

• I/O: 1 VGA, 2 COM, TPM header

• 2 SuperDOM with built-in power

• M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M-Key
Double Height Connector

• 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP

• Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)

• Intel® C622 chipset

• Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8)

• 2 10G SFP+

• 12 SATA3 (6Gbps) via C622

• Supports 12V DC power input

• I/O: 1 VGA, 2 COM, 1 TPM header

• 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)

• M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4
Form Factor: 2242, 2280
Key: M-Key
Double Height Connector

• 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP

• Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)

• Intel® C622 chipset

• Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8)

• 2 10GbE LAN ports

• 12 SATA3 (6Gbps) via C622

• Supports 12V DC power input

• I/O: 1 VGA, 2 COM, TPM header

• 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)

• M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4
Form Factor: 2242, 2280
Key: M-Key
Double Height Connector

• 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP

• Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)

• Intel® C621 Chipset

• Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8)

• 2 GbE LAN ports

• 12 SATA3 (6Gbps) via C621

• Supports 12V DC power input

• I/O: 1 VGA, 2 COM, TPM header

• 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)

• M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4
Form Factor: 2242, 2280
Key: M-Key
Double Height Connector

• 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP

• Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)

• Intel® C621 Chipset

• Expansion slots:
2 PCI-E 3.0 x8 (in x16),
4 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)

• 2 GbE LAN ports

• 8 SATA3 (6Gbps) ports

• I/O: 1 VGA, 2 COM, TPM header

• 2 SuperDOM with built-in power

• 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)

• M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M-Key
Double Height Connector

• 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP

• Intel® C622

• Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots

• Expansion slots:
1 PCI-E 3.0 x16,
1 PCI-E 3.0 x16 (x16 || x8),
1 PCI-E 3.0 x8 (x0 || x8),
1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)

• 2 10GbE LAN ports

• 10 SATA3 (6Gbps) via C622

• I/O: 1 VGA, 2 COM, TPM header

• 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)

• M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M-Key
Double Height Connector

• 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP

• Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots

• Intel® C622 chipset

• Expansion slots:
1 PCI-E 3.0 x16 (x16 || x8),
1 PCI-E 3.0 x8 (x0 || x8),
1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)

• 2 10G SFP+

• 10 SATA3 (6Gbps) via C622

• 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10

• 2x Port NVMe PCI-E 3.0 x4 via OCuLink

• 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)

• M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280
Key: M-Key
Double Height Connector

• 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP

• Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots

• Intel® C622 chipset

• Expansion slots:
1 PCI-E 3.0 x16 (x16 || x8),
1 PCI-E 3.0 x8 (x0 || x8),
1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)

• 2 10GbE LAN ports

• 10 SATA3 (6Gbps) via C622

• 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10

• 2x Port NVMe PCI-E 3.0 x4 via OCuLink

• 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)

• M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280
Key: M-Key
Double Height Connector

• 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP

• Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots

• Intel® C621 Chipset

• 3 PCI-E 3.0 x16

• 2 10GbE LAN ports

• 6 SATA (6Gbps)

• 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 4 USB 2.0 (2 rear, 2 via headers)

• 2 SuperDOM with built-in power

• I/O: 1 VGA, 1 COM, TPM header

• 2x M.2 NGFF connectors
M.2 Interface: PCI-E 3.0 x4
Form Factor: 2280
Key: M-Key
Double Height Connector