X11SPW-CTF
PrintKey Features
- • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
- • Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
- • Intel® C622 chipset
- • Expansion slots:
1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x32 Left Riser slot
- • 4 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
- • 2 10GbE LAN ports
- • 10 SATA3 (6Gbps) via C622
- • I/O: 1 VGA, 2 COM, TPM header
- • 2 SuperDOM with built-in power
- • M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M-Key
Double Height Connector
Specifications
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Parts List
Parts List (Bulk Package) | |||
Name | Part Number | Qty | Description |
Motherboard | MBD-X11SPW-CTF | 1 | Supermicro Motherboard |
I/O Cables | CBL-0044L | 2 | 57.5CM SATA FLAT S-S PBF |
Optional Parts List | |||
Name | Part Number | Qty | Description |
TPM security module | AOM-TPM-9670H | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor |
TPM security module | AOM-TPM-9670V | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |
TPM security module | AOM-TPM-9671H | 1 | SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor |
TPM security module | AOM-TPM-9671V | 1 | SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor |
Chassis
(Optimized for
X11SPW-CTF
)Embedded Compact | 1U | 2U | 3U | Mid/Mini-Tower | 4U/Tower |
1U Heatsink:SNK-P0067PS |
SC815TQC-605WB SC815TQC-R504WB SCLA15TQC-563W 1U Heatsink:SNK-P0067PS |
SC825MBTQC-R802WB SC825TQ-R500WB 2U Heatsink:SNK-P0068PS |
= Most optimized Chassis for SuperServer Configuration
Blue color = Compatible
Green color = Global SKU & Compatible
Red dot & green color = Optimized + Global SKU
Blue color = Compatible
Green color = Global SKU & Compatible
Red dot & green color = Optimized + Global SKU