Key Features

• Key Applications
  - Virtualization
  - Enterprise Server
  - Data Center Optimized
  - Application and data serving
  - Model analysis
  - Compute Intensive Applications
  
  Key Features
  1. Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors
  CPU TDP supports Up to 270W TDP
  3 UPI up to 11.2 GT/s
  
• 2. Intel® C621A Chipset
  
• 3. Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz_x000D_
  Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz_x000D_
  Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slots_x000D_ (P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only)
  
• 4. 4 PCI-E 4.0 x16 Low Profile (LP)
  2 PCI-E 4.0 x8 Low Profile (LP)
  
• 5. Dual 10GBase-T LAN with Intel® X550 Ethernet Controller
  
• 6. 8 hotswap 3.5" SATA3 (6 Gbps) drive bays with Intel® C621A controller for RAID 0,1,5,10
  1 M.2 support:
  - M.2 Interface: PCI-E 3.0 x4
  - M.2 Form Factor: 2260, 2280, 22110
  - M.2 Key: M-Key
  Optional 1 slim DVD-ROM drive
  Optional 2 fixed 2.5" NVMe/SSD/HDD/SuperDOM
  
• 7. 3 heavy duty Hot-swappable 13.5K RPM Middle Cooling Fans with optimal fan speed control
  1 air shroud
  
• 8. 1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240 Vdc
  
• 9. 1 rear VGA, 1 Type A port, 2 COM Ports(1 front; 1 rear) and 6 USB ports (2 front USB 2.0 and 4 rear USB 3.0)