X12DPi-NT6
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Key Features
- 1. 3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
- 2. Intel® C621A
- 3. Up to 4TB RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 series only.
- 4. 2 PCI-E 4.0 x8,
4 PCI-E 4.0 x16,
2 PCI-E 4.0 NVMe x8 Internal Port(s)
M.2 Interface: 1 PCI-E 4.0 x4
M.2 Form Factor: 2280/22110
M.2 Key: M-Key
- 5. 2 VGA (1 rear bezel, 1 front panel) ports
- 6 Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- 7. Dual LAN with 10GBase-T with Intel® X550
Specifications
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Parts List
| Parts List (Bulk Package) | |||
| Name | Part Number | Qty | Description |
| Motherboard | MBD-X12DPi-NT6 | 1 | X12DPi-NT6 Motherboard |
| I/O Shield | MCP-260-00042-0N | 1 | STD I/O SHIELD |
| I/O Cables | CBL-0044L | 2 | 57.5 cm SATA FLAT S-S PBF |
| CPU carrier | SKT-1205L-P4IC-FXC | 2 | CPU carrier for 3rd Gen Intel Xeon Scalable Processors |
| Parts List (Retail Package) | |||
| Name | Part Number | Qty | Description |
| Motherboard | MBD-X12DPi-NT6 | 1 | X12DPi-NT6 Motherboard |
| I/O Shield | MCP-260-00042-0N | 1 | STD I/O SHIELD |
| I/O Cables | CBL-0044L | 2 | 57.5 cm SATA FLAT S-S PBF |
| I/O Cables | CBL-0476L | 1 | IPASS to 4 SATA cable |
| CPU carrier | SKT-1205L-P4IC-FXC | 2 | CPU carrier for 3rd Gen Intel Xeon Scalable Processors |
| Quick Reference Guide | MNL-2233-QRG | 1 | X12DPi-N(T)6 Quick Reference Guide |
| Optional Parts List | |||
| Name | Part Number | Qty | Description |
| TPM security module (optional, not included) | AOM-TPM-9670V-S | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |
| TPM security module (optional, not included) | AOM-TPM-9670H-S | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor |
| TPM security module (optional, not included) | AOM-TPM-9671V-S | 1 | SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor |
| TPM security module (optional, not included) | AOM-TPM-9671H-S | 1 | SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor |
Chassis
(Optimized for
X12DPi-NT6
)| Embedded Compact | 1U | 2U | 3U | Mid/Mini-Tower | 4U/Tower |
 SC213BAC8-R1K23LPB SC826BAC12-R1K23LPB SC825BTQC-R1K23LPB 2U Heatsink:SNK-P0078PC (Front) 2U Heatsink:SNK-P0078P (Rear) |
SC745BAC-R1K23B2U Heatsink:SNK-P0078P |
= Most optimized Chassis for SuperServer Configuration
Blue color = Compatible
Green color = Global SKU & Compatible
Red dot & green color = Optimized + Global SKU
Server (Optimized for X12DPi-NT6)