SBI-620P-1C3N
PrintKey Features
- Key Applications
- Cloud Service
- Simulation & Modeling
- AI Inferencing
- High-performance Computing (HPC)
Key Features
- 1. 140 CPUs per 42U Rack
- 2. Dual socket P+ (LGA-4189) supports 3rd Gen Intel® Xeon® Scalable processors
- 3. Intel® C621A chipset
- 4. 32 DIMMs; up to 8TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM
- 5. 2 Hot-plug 2.5" NVMe + 1 Hot-plug SAS3/SATA3 drives or 3 SAS3/SATA3
- 6. Dual 25G onboard Ethernet
- 7. IPMI 2.0, KVM over IP, Virtual Media over LAN
- 8. Graphics: Aspeed AST2600
- 9. Cooling: Passive CPU heatsink CPU1: SNK-P1044V CPU2: SNK-P0077V
- 10. Broadcom 3108 HW RAID
Specifications
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Parts List
Parts List - (Items Included) | |||
Part Number | Qty | Description | |
Motherboard / Chassis | MBD-B12DPE-6-P MCP-680-61003-0N |
1 1 |
Super B12DPE-6 Motherboard 6U 10 SuperBlade DP Blade chassis |
Add-on Card / Module | AOM-BPNIO-SCE-P | 1 | AOM-BPNIO-SC, I/O module for uBlade,RoHS |
Hard Drive Tray | MCP-220-00170-0B | 2 | Black hot swap tool-less NVMe 2.5" HDD tray with orange button |
Air Shroud | MCP-310-61001-0B | 1 | 6U 10 SuperBlade B11DPE Processor Tray Air Shroud |
Optional Parts List | |||
Part Number | Qty | Description | |
TPM security module (optional, not included) |
AOM-TPM-9670VAOM-TPM-9671V | 1 | TPM module (Vertical) TPM 2.0TPM module (Vertical) TPM 1.2. |
Heatsink / Retention | SNK-P0077V | - | X12 ICX/CPX CPU Heatsink (78x113x25.5mm), VC Base, Cu Fin |
Heatsink / Retention | SNK-P1044V | - | 1U Passive CPU Heat Sink for B12 ICX/CPX CPU |
AOC | AOC-VROCPREMOD AOC-VROCSTNMOD |
- | Intel VROC Premium, RAID 0, 1, 5, 10 Intel VROC HW key (RSTe) standard upgrade module |
Networking | AOC-B25G-6X4D | - | Dual-port 25G Mezz card for SuperBlade 6U Chassis (Mellanox ConnectX-4 Lx EN) |
Software | SFT-OOB-LIC | 1 | OOB Management Package (per node license) |
Software | SFT-DCMS-Single | 1 | DataCenter Management Package (per node license) |