X12DPFR-AN6
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Key Features
- 1. 3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 165W TDP, 3 UPI up to 10.4 GT/s
- 2. Intel® C621A
- 3. Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 16 DIMM slots
- 4. 1 PCI-E 4.0 x16 Right Riser Slot,
1 PCI-E 4.0 x8 connector for SMC add-on cards,
3 PCI-E 4.0 NVMe x8 Internal Port(s)
1 PCI-E 4.0 x16, OCP 3.0 compliant
- 5. Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- 6. 1 VGA port
- 7. Single LAN with
Networking options provided via AIOM module
Specifications
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Parts List
Parts List (Bulk Package) | |||
Name | Part Number | Qty | Description |
Motherboard | MBD-X12DPFR-AN6 | 1 | X12DPFR-AN6 Motherboard |
Optional Parts List | |||
Name | Part Number | Qty | Description |
TPM security module (optional, not included) | AOM-TPM-9670V | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |
AOM-TPM-9670H | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor |
Chassis
(Optimized for X12DPFR-AN6)
Embedded Compact | 1U | 2U | 3U | Mid/Mini-Tower | 4U/Tower |
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Blue color = Compatible
Green color = Global SKU & Compatible
Red dot & green color = Optimized + Global SKU
Server
(Optimized for X12DPFR-AN6)
Server Name |
SYS-F610P2-RTN |
SYS-F620P3-RTBN |