SYS-620BT-HNTR
Print
Intergrated Board
Key Features
- Key Applications
- Hyperconverged Infrastructure
- Container Storage
- Scale-Out File Server
Key Features
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors
- 2. Intel® C621A
- 3. 20 DIMM Slots (16 DIMM Slots + 4 Intel® Optane™ Persistent Memory Slots)
- 4. 2 PCI-E 4.0 x16 (LP) slot;
Tool-less support
Internal PCI-E 3.0 x8 for 2 M.2 NVMe/SATA support onboard
Optional NVMe Boot Controller via AOC-SMG3-2M2-B
- 5. Network connectivity via AIOM (OCP 3.0 compliant)
- 6. 3 Hot-swap 3.5" drive bays; 3 PCI-E 4.0 NVMe/SATA 3.5" drives
- 7. 4 cooling fans per 2U enclosure, 14.9K RPM; Shared Cooling Design
Liquid Cooling Support
- 8. 2600W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
Specifications
|
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Titanium Level Parts List
 |
|||
| Parts List - (Items Included) | |||
 |
|||
| |
Part Number |
Qty |
Description |
| Motherboard / Chassis |
MBD-X12DPT-B6 CSE-827BQ-000NP |
4 1 |
Super X12DPT-B6 Motherboard 2U Chassis |
| Add-on Card / Module | AOC-SMG3-2H8M2-BW-P | 4 | 2x Hybrid M.2 riser carrier card for X12 BigTwin,RoHS |
| Backplane | BPN-NVME4-827BHQ-S3 | 1 | 2U 12-Port 4-Node All-Hybrid BT BPN for 3xNVMe4/SAS4/SATA3 Medias per Node |
| Cable 1 | CBL-PWCD-0376-IS | 2 | PWCD,US,IEC60320 C19 TO C20,940mm (3ft),14AWG,15A,250V,Black |
| Cable 2 | CBL-SAST-1243-100 | 4 | Slimline X8 (STR) to Slimline X8 (STR), 41.5CM,100 OHM |
| Drive Tray(s) | MCP-220-00133-0B-BULK | 12 | Black gen 8 hot-swap 3.5 |
| Air Shroud | MCP-310-21730-0B | 4 | BigTwin 2U4N plastic air shroud for X12DPT-B |
| Riser Card | RSC-PR-6-X2 | 4 | 1U RHS TwinPro Riser card with one PCI-E 4.0 x16 slot,HF,RoH |
| Heatsink / Retention | SNK-P0077PW | 4 | 1U Passive CPU HS 92mm Width for X12 Whitley Platform |
| Heatsink / Retention | SNK-P0077VM | 4 | X12 ICX/CPX CPU Heatsink (78x113x25.5mm), VC Base w/ Channel |
| *Power Supply | PWS-2K60A-1R | 2 | 1U 2600W Redundant Titanium PWS, 45(W) X 40(H) X 480(L) |
| *Power Distributor | PDB-PT217-BGTWN | 1 | 2U Big Twin Power Distributor Board Support Redundant 2KW |
Notes:
|
|||
|
|||
| Optional Parts List | |||
|
|||
| Part Number | Qty | Description | |
| 3.5-to-2.5" HDD Conversion Tray | MCP-220-00140-0B | - | Black gen 8 hot-swap 3.5-to-2.5 Tool-less HDD tray, orange tab |
| CacheVault for RAID Controller | BTR-CVPM05 | - | Broadcom CacheVault |
| BKT-BBU-BRACKET-05 | - | Mounting Bracket | |
| M.2 NVMe RAID Controller | AOC-SMG3-2M2-B-P | - | 2x M.2 NVMe RAID Controller Card |
| SAS3908 RAID Controller | AOC-S3908L-H8iR-16DD | - | SAS3908 HW RAID Controller 12Gb/s SAS, x8 Gen4 |
| CBL-SAST-1234F-100 | - | Slimline x8 (STR) to Slimline x8 (STR) for 8 drives support | |
| SPI Capable TPM 1.2 | AOM-TPM-9671H-S | - | SPI Capable TPM 1.2 Provisioned for Server, Horizontal Form Factor |
| SPI Capable TPM 2.0 | AOM-TPM-9670H-S | - | SPI Capable TPM 2.0 Provisioned for Server, Horizontal Form Factor |
| SPI Capable TPM 2.0 with FIPS 140-2 | AOM-TPM-9670H-FIPS | - | SPI Capable TPM 2.0 Provisioned for Server, Horizontal Form Factor, Supporting FIPS 140-2 |
| SuperCloud Composer License | SFT-SDDC-SINGLE | - | SDDC Monitor License - Single License per Monitored host |
| System Management Suite | SFT-DCMS-Single | - | Supermicro System Management Software Suite node |
| VROC Intel SSD Only | AOC-VROCINTMOD | - | Intel VROC, RAID 0, 1, 5, 10 (Intel SSD Only) |
| VROC Premium | AOC-VROCPREMOD | - | Intel VROC Premium, RAID 0, 1, 5, 10 |
| VROC Standard | AOC-VROCSTNMOD | - | Intel VROC Standard, RAID 0, 1, 10 |