SYS-520P-WTR
PrintIntergrated Board
Key Features
- Key Applications
- Data Center Optimized
- Database Processing and Storage
- Network Appliance
Key Features
1. Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP.
- 2. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM
- 3. 2 PCI-E 4.0 x16 (FHFL) slots, 2 PCI-E 4.0 x8 (LP) slots
- 4. Intel® Ethernet Controller X550 2x 10GbE RJ45
- 5. 8x hot-swap 3.5'' SATA3 drive bays, SAS3 with additional SAS controller card, Optional 2x 2.5'' Gen4 NVMe drives at rear; Onboard 1x NVMe/SATA M.2
- 6. Redundant Platinum 650W Power Supply
Specifications
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Parts List
Parts List - (Items Included) | |||
|
Part Number |
Qty |
Description |
Motherboard / Chassis |
MBD-X12SPW-TF CSE-825BTS-R609WP |
1 1 |
Super X12SPW-TF Motherboard 2U Chassis |
Backplane | BPN-SAS3-825TQ | 1 | 8-port 2U SAS3 12Gbps TQ backplane, support up to 8x 3.5-inch SAS3/SATA3 HDD/SSD |
Cable 1 | CBL-SAST-0699 | 2 | MINI SAS HD-4 SATA,12G,INT,75/75/90/90CM,75CM SB,28/30AWG,Ro |
Manual | MNL-2264-QRG | 1 | 520P-WTR Quick Reference Guide |
Riser Card | RSC-W2-66G4 | 1 | 2U LHS WIO Riser card with two PCI-E 4.0 x16 slots,HF,RoHS |
Riser Card | RSC-W2R-88G4 | 1 | 2U RHS WIO Riser card with two PCI-E 4.0 x8 slots,HF,RoHS |
Heatsink / Retention | SNK-P0078P | 1 | 2U Passive CPU Heat Sink for X12 Generation Intel Whitley and Cedar Island Platforms |
*Power Supply | PWS-609P-1R2 | 2 | 1U, platinum efficiency, 600W/650W, AC input: 100-127/200-240Vac. |
*Power Distributor | PDB-PT825-8824 | 1 | SC825 24PIN REDUNDANT POWER DISTRIBUTOR |
*Cable 2 | CBL-0071L | 1 | ROUND 16 TO 16 PIN RIBBON FP CABLE 30"L, LF |
*Cable 3 | CBL-0160L | 2 | US POWER CORD 16AWG, PB FREE |
*FAN 1 | FAN-0181L4 | 3 | 80x80x38 mm, 9.4K RPM, Hot-swappable Middle Cooling Fan for X11 Purley Platform Newly Enabled 2U+ Chassis |
*Front Panel | FPB-FP836-D | 1 | Front control board Dual color LED(FP836-D)forSC823M,825,825M,828,829,835,836 |
*Drive Tray(s) | MCP-220-00023-01 | 1 | Black USB dummy tray support 1x 2.5" slim HDD for SC825, 836 |
*Drive Tray(s) | MCP-220-00075-0B | 8 | Black gen 5.5 hot-swap 3.5" HDD tray |
*Drive Tray(s) | MCP-220-82502-0B | 2 | Black fixed 3.5\" HDD tray or FDD dummy tray |
*Rear Window | MCP-240-82609-0N | 1 | SC826B, 216B WIO rear window |
*Peripheral Drive1 | MCP-290-00007-01 | 1 | Black DVD dummy cover for SC825, 836 |
*Rail Set | MCP-290-00053-0N | 1 | Rail set, quick/quick, default for 2,3U 17.2";W |
*Drive Tray(s) | MCP-290-82607-0N | 1 | 826B/216B rear dummy cover for 2 X 2.5 |
*Air Shroud | MCP-310-29001-0N | 1 | SC825/826/216/213 Intel DP X9,X8 air shroud 13.68x13/12x13 |
Notes:
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Optional Parts List | |||
Part Number | Qty | Description | |
2x 2.5" NVMe Cage (Rear) | MCP-220-82619-0N + 1x CBL-SAST-1154-85 | 1 | Rear hot-swap 2x 2.5" NVMe drive kit |
2x 2.5" SATA/SAS Cage (Rear) | MCP-220-82616-0N | 1 | Rear hot-swap 2x 2.5" SATA/SAS drive kit |
3.5" to 2.5" Converter Tray(s) | MCP-220-00043-0N | - | Hot-swap Gen-4 3.5" to 2.5" HDD tray, Black |
Add-on Card for additional M.2 | AOC-SLG3-2H8M2 | - | Standard LP, PCI-E 3.0 x8, supports 2x NVMe/SATA M-Key M.2 Modules; RAID 0,1 |
Cable for Internal HDD | CBL-0484L | 2 | 55cm 30AWG SATA straight to straigh cable |
CBL-0289L | 1 | Y split, big 4 pin to two RA SATA power estenstion 30cm | |
CacheVault | BTR-CVPM05 + MCP-240-00127-0N (For S3908) | 1 | CacheVault for Broadcom 3908 with SuperCap mounting bracket for internal fixed bay |
BTR-TFM8G-LSICVM02 + BKT-BBU-BRACKET-05 (For S3108) | 1 | CacheVault for Broadcom 3108 with SuperCap mounting bracket for PCI-E location | |
BTR-TFM8G-LSICVM02 + MCP-240-00127-0N (For S3108) | 1 | CacheVault for Broadcom 3108 with SuperCap mounting bracket for internal fixed bay | |
BTR-CVPM05 + BKT-BBU-BRACKET-05 (For S3908) | 1 | CacheVault for Broadcom 3908 with SuperCap mounting bracket for PCI-E location | |
DVD-ROM / DVD-RW | DVM-PLDS-DVDRW-SBT5 | 1 | PHILPS slim DVD-RW SATA drive |
DVM-TEAC-DVD-SBT5 | 1 | TEAC slim DVD-ROM SATA drive | |
DVD-ROM Accessory | MCP-220-81502-0N | 1 | Slim SATA DVD mounting kit |
Front Bezel | MCP-210-82503-0B | 1 | Black Front Bezel |
Inlet Thermal Sensor | MCP-280-00033-0N | 1 | Universal Thermal sensor kit with 80cm I2C cable |
Intel VROC RAID Key for NVMe | AOC-VROCPREMOD | 1 | Premium Upgrade module (Intel + 3rd party Vendor SSD); RAID 0/1/10/5 |
AOC-VROCINTMOD | 1 | Intel SSD Only Upgrade module; RAID 0/1/10/5 | |
AOC-VROCSTNMOD | 1 | Standard Upgrade module (Intel + 3rd party Vendor SSD); RAID 0/1/10 | |
Software | SFT-DCMS-Single | 1 | DataCenter Management Package (per node license) |
Storage Control Card and Cable(s) | AOC-S3008L-L8I | 1 | Standard LP, 8 internal ports (12Gb/s) PCI-E 3.0 x8, 63HDD; RAID 0, 1, 10 |
AOC-S3108L-H8iR-16DD | 1 | Standard LP, 8 Internal ports (12Gb/s) PCI-E 3.0 x8, 16HDD; RAID 0, 1, 5, 6, 10, 50, 60 | |
AOC-S3908L-H8iR-16DD + 1x CBL-SAST-1270-100 | 1 | Standard LP, 8 internal ports (12Gb/s) PCI-E 4.0 x8, 16HDD; RAID 0, 1, 5, 6, 10, 50, 60 | |
Storage Control Card and Cable(s) (HBA) | AOC-S3008L-L8E | 1 | Standard LP, 8 internal ports (12Gb/s) PCI-E 3.0 x8, 122HDD; HBA |
AOC-S3808L-L8IT + 1x CBL-SAST-1270-100 | 1 | Standard LP, 8 internal ports (12Gb/s) PCI-E 4.0 x8, 122HDD; HBA | |
TPM | AOM-TPM-9670V-S | 1 | TPM 2.0, vertical form factor, provisioned for server |
AOM-TPM-9671V-S | 1 | TPM 1.2, vertical form factor, provisioned for server | |
WIO Riser Card | RSC-W2-8888G4 | 1 | 2U LHS WIO Riser card with 4x (PCI-E 4.0 x8) slots |
RSC-W2-688G4 | 1 | 2U LHS WIO Riser card with 1x (PCI-E 4.0 x16) and 2x (PCI-E 4.0 x8) slots |