Key Features

• Key Applications
  - High Performance Computing
  - Enterprise Server
  - Data Center Optimized
  - Database Processing and High Density Storage
  - Application-Optimized Solutions
  
  Key Features
  1. Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors
  CPU TDP supports Up to 270W TDP
  3 UPI up to 11.2 GT/s
  
• 2. Intel® C621A Chipset
  
• 3. Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only.
  
• 4. 4 PCI-E 4.0 x16 Low Profile (LP)
  1 PCI-E 4.0 x8 Low Profile (LP)
  * PCi-E slot 1 is populated with 1x AOC-S3908L-H8IR-16DD-P to support 8x SAS drives
  
• 5. Dual Gigabit LAN with Intel® i350 Ethernet Controller
  
• 6. 16 hotswap 2.5" drive bays
  8 SAS drives wih Broadcom® 3908 Gen4 HW RAID controller for RAID 0, 1, 5, 6, 10, 50, 60
  8 SATA drives with Intel® C621A controller for RAID 0,1,5,10
  1 M.2 support:
  - M.2 Interface: PCI-E 3.0 x4
  - M.2 Form Factor: 2260, 2280, 22110
  - M.2 Key: M-Key
  Optional 1 slim or 5.25" DVD-ROM drive
  Optional 4x hotswap 2.5" NVMe or 2 fixed 2.5" NVMe/SSD/HDD/SuperDOM
  
• 7. 3 heavy duty Hot-swappable 13.5K RPM Middle Cooling Fans with optimal fan speed control
  1 air shroud
  
• 8. 1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240 Vdc
  
• 9. 1 rear VGA, 1 Type A port, 2 COM Ports(1 front; 1 rear) and 6 USB ports (2 front USB 2.0 and 4 rear USB 3.0)