AS -2123BT-HNC0R
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Intergrated Board
Key Features
- - Compute Intensive Application
- HPC, Data Center, Enterprise Server
- Hyperscale / Hyperconverged
- Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- 1.Dual AMD EPYC™ 7001/7002* Series Processors (*AMD EPYC 7002 series drop-in support requires board revision 2.x)
- 2.2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs (7001 Processors)
4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs (Board revision 2.x required + 7002 Processors)
- 3.2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking)
Note: must bundle with Network card
- 4.Integrated IPMI 2.0 + KVM with dedicated LAN
• Software Out of Band License
key (SFT-OOB-LIC) included
for OOB BIOS management
- 5.6 SAS3, or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays
M.2 Interface: 1 SATA/PCI-E 3.0 x4
M.2 Form Factor: 2280, 22110
M.2 Key: M-key
- 6.SAS3 support via Broadcom 3008; IT mode
- 7.Video via Aspeed AST2500 BMC
- 8.2200W Redundant Power Supplies
Titanium Level (96%)
(Full redundancy based on configuration and application load)
Specifications
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Titanium LevelParts List
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| Parts List - (Items Included) | |||
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Part Number |
Qty |
Description |
| Motherboard / Chassis |
MBD-H11DST-B CSE-217BHQ+-R2K22BP2 |
4 1 |
Super H11DST-B Motherboard 2U Chassis |
| Backplane | BPN-ADP-6S3008N4-1UB | 4 | Big Twin 1U hybrid ADP supporting 6x SAS3 and 4x NVMe |
| Backplane | BPN-SAS3-217BHQ-N4 | 1 | 2U 4-Node 24-Port Backplane Supports 2x2.5\" SATA3/SAS3 SSD/HDD and 4x2.5\" SATA3/SAS3/NVMe Stoage Media per Node |
| Drive Tray(s) | MCP-220-00141-0B-BULK | 8 | Black Gen3 hot-swap 2.5 inch HDD tray with lock improved EMI |
| Drive Tray(s) | MCP-220-00144-0B-BULK | 16 | Black Gen3 hot-swap 2.5 inch HDD tray with lock, orange tab |
| Parts | MCP-240-21730-0N | 1 | 217B BigTwin type I (Impact) BPN retention bkt w/ foam assy |
| Riser Card | RSC-P-6 | 4 | RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS |
| Riser Card | RSC-R1UTP-E16R | 4 | 1U RHS TwinPro Riser card with one PCI-E x16 slot |
| Software | SFT-OOB-LIC | 4 | License key for enabling OOB BIOS management |
| Heatsink / Retention | SNK-P0062PM | 4 | 1U Passive Front CPU Heat Sink w/ a 30-mm Wide Middle Air Channel for AMD H11 2U4N Big Twin Series Servers |
| Heatsink / Retention | SNK-P0062PW | 4 | 1U Proprietary 93-mm Wide Passive Rear CPU Heat Sink for AMD H11 2U4N Big Twin Series Servers |
| Power Supply | PWS-2K22A-1R | 2 | 1U 2200W Redundant Power Supply Titanium, 45(W) X 40(H) X 48 |
| FAN | FAN-0183L4 | 4 | 80x80x38 mm, 16.5K RPM, Non-hot-swappable Middle Cooling Fan for X11 Twin Pro, X10 and X11 Big Twin Series Servers |
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| Optional Parts List | |||
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| Part Number | Qty | Description | |
| Global Services & Support |
OS4HR3/2/1 OSNBD3/2/1 |
- - |
3/2/1-year onsite 24x7x4 service 3/2/1-year onsite NBD service |
| Software | SFT-DCMS-Single | 1 | DataCenter Management Package (per node license) |
| TPM security module | AOM-TPM-9655V | - | TPM 1.2 module with Infineon 9655, RoHS/REACH,PBF; |
| AOM-TPM-9655V-S | - | TPM 1.2 module with Infineon 9655, RoHS/REACH,PBF; Provisioned for TXT | |
| AOM-TPM-9665V | - | TPM 2.0 module with Infineon 9665, RoHS/REACH,PBF; | |
| AOM-TPM-9665V-S | - | TPM 2.0 module with Infineon 9665, RoHS/REACH,PBF; Provisioned for TXT | |
| SIOM | - | - | Supermicro SIOM solutions [Details] |