AS -2113S-WN24RT
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Intergrated Board
Key Features
- - Virtualization
- Hyperconverged Storage
- Cloud Computing
- All Flash Storage
- 1.Single AMD EPYC™ 7001/7002 Series Processor (AMD EPYC 7002 series drop-in support requires board revision 2.x)
- 2.2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs
4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs (Board revision 2.x required)
- 3.Expansion slots:
1 PCI-E 3.0 x16 (FH/HL) slot
M.2 Interface: PCI-E 3.0 x2 (NVMe based)
M.2 Form Factor: 2280, 22110
M.2 Key: Onboard M-key
Number of M.2: Dual
- 4.Integrated IPMI 2.0 + KVM with dedicated LAN
• Software Out of Band License
key (SFT-OOB-LIC) included
for OOB BIOS management
- 5.2x 10GBase-T LAN ports via Broadcom BCM57416
- 6.24 hot-swap 2.5" U.2 NVMe drive bays
- 7.1200W Redundant Power Supplies
Titanium Level (96%)
(Full redundancy based on configuration and application load)
Specifications
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Titanium LevelParts List
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| Parts List - (Items Included) | |||
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| Part Number | Qty | Description | |
| Motherboard | MBD-H11SSW-NT | 1 | Super H11SSW-NT Motherboard |
| Chassis | CSE-216BTS-R1K23WBP | 1 | 2U Chassis |
| HD Backplane | BPN-NVME3-216N-S4 | 1 | 24-port 2U (SC216/219) NVMe direct-attached backplane, support 24x 2.5-inch NVMe devices |
| Add-on Card | AOC-SLG3-2E4R-P | 2 | NVMe AOC by 8,HF,RoHS/REACH |
| Add-on Card | AOC-SLG3-4E4R-P | 1 | NVMe AOC by 16,HF,RoHS/REACH |
| Cable(s) | CBL-PWEX-1070 | 1 | PWEX,2X2F/P4.2 TO 1X4M/P5.08 x2,BLK*2,YEL*2,40CM,16AWG |
| Cable(s) | CBL-PWEX-1071 | 1 | PWEX,2X4F/P4.2 TO 2X2M/P4.2 x2,BLK*4,YEL*4,15/30CM,16AWG |
| Cable(s) | CBL-SAST-0815 | 6 | SLIMLINE SAS x8 to 2x Oculink x4,INT, 22CM,34AWG |
| Cable(s) | CBL-SAST-0817 | 2 | SLIMLINE SAS x8 (LA) to 2x Oculink x4,INT, 36CM,34AWG |
| Cable(s) | CBL-SAST-0841 | 4 | MiniSAS HD source to OcuLink v 1.0,INT,PCIe, 76CM,34AWG,RoHS |
| Cable(s) | CBL-SAST-0849 | 4 | MiniSAS HD source to OcuLink v 1.0,INT,PCIe, 57CM,34AWG |
| Riser Card | RSC-R2UW-2E8R | 1 | 2U RHS WIO Riser card with two PCI-E x8 slots |
| Riser Card | RSC-W2-66 | 1 | RSC-W2-66 |
| Heatsink / Retention | SNK-P0063P | 1 | 2U Passive CPU Heat Sink for AMD Socket SP3 Processors |
| Mounting Rail(s) | MCP-290-00053-0N | 1 | Rail set, quick/quick, default for 2,3U 17.2";W |
| Fan(s) | FAN-0158L4 | 3 | 80x80x38 mm, 10.5K RPM, Optional Middle Cooling Fan for X10 2U Ultra and HFT Series Servers,RoHS/REACH |
| Software | SFT-OOB-LIC | 1 | License key for enabling OOB BIOS management |
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| Optional Parts List | |||
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| Part Number | Qty | Description | |
| Parts | MCP-220-82616-0N | 1 | 12G 2.5x2 Drive Kit w/ Status LED(216B/826B/417B/846X/847B) |
| Cable Management Arm | MCP-290-00073-0N MCP-120-82503-0N | - | Supermicro Cable Management Arm for 2U, 3U and 4U chassis Cable arm adapter for SC825,213,829H,847B (MCP-290-00073-0N required),HF,RoHS/REACH,PBF |
| TPM | AOM-TPM-9655V | - | Vertical TPM with Infineon 9655 TCG 1.2 |
| AOM-TPM-9655V-S | - | Based on AOM-TPM-9655V with Server TXT package | |
| AOM-TPM-9665V | - | AOM-TPM-9665V using SLB9665 Chipset supporing TPM2.0,RoHS/REACH | |
| AOM-TPM-9665V-S | - | Vertical TPM TCG 2.0 Provisioned for a server,RoHS/REACH | |
| Global Services & Support | OS4HR3/2/1 | - | 3/2/1-year onsite 24x7x4 service |
| OSNBD3/2/1 | - | 3/2/1-year onsite NBD service | |
| Software | SFT-DCMS-Single | 1 | DataCenter Management Package (per node license) |