슈퍼솔루션

슈퍼마이크로 슈퍼마이크로는 기업 컴퓨팅, 스토리지, 네트워킹 솔루션 및 그린 컴퓨팅 기술 분야의 글로벌 리더입니다.

    SYS-2029U-MTNRV-NEBS-DC

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    Key Features

    • - Telecom Central Office and Data Center
      - 5G Core and Edge Computing
      - AI Inference and Machine Learning
      - Network Functions Virtualization
      - Cloud Computing

    • ·NEBS Level 3 Certified
    • ·Dual Socket P (LGA 3647):
      Intel® Xeon® Gold 6240R
    • ·24 DIMMs; up to 1.5TB 3DS ECC
      DDR4-2933MHz† RDIMM
    • ·Up to 8 PCI-E Add-on Cards
    • ·Flexible LAN options
    • ·6 Hot-swap 2.5" drive bays
      6 NVMe/SATA ports (NVMe
      from CPU1) or 6 SATA ports
    • ·6 Hot-swap Heavy duty 6cm PWM fans
    • ·Redundant Power Supplies
      1300W DC Power Supplies
    • ·GPU Support (Optional)
    Specifications
    Product SKUs
    SYS-2029U-MTNRV-NEBS-DC
    • SuperServer 2029U-MTNRV-NEBS-DC
     
    Motherboard
    Super X11DPU-V
     
    Processor
    CPU
    • Dual Socket P (LGA 3647)
    • Intel® Xeon® Gold 6240R Processors (2.4GHZ) integrated for Complete System, CPU TDP 165W
    Cores
    • 24 Cores
     
    System Memory
    Memory Capacity
    • 24 DIMM slots
    • Up to 1.5TB 3DS ECC DDR4-2933MHz RDIMM
    Memory Type
    • 2933/2666/2400/2133MHz ECC DDR4 RDIMM
    • 2666 ECC DDR4 NVDIMM
    Note 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
     
    On-Board Devices
    Chipset
    • Intel® C621 chipset
    SATA
    • SATA3 (6Gbps); RAID 0, 1, 5, 10
    Network Connectivity
    • Flexible Networking options
    Graphics
    • ASPEED AST2500 BMC
     
    Input / Output
    SATA
    • 6 SATA3 (6Gbps) ports
    LAN
    • Flexible LAN options
    USB
    • 2 USB 3.0 ports (rear)
    Video
    • 1 VGA Connector
    Serial Header
    • 1 Serial header
    DOM
    • 2 SuperDOM (Disk on Module) ports
     
    System BIOS
    BIOS Type
    • AMI 32Mb SPI Flash ROM
     
    Management
    Software
    Power Configurations
    • ACPI Power Management
     
    PC Health Monitoring
    CPU
    • Monitors for CPU Cores, Chipset Voltages, Memory.
    • 4+1 Phase-switching voltage regulator
    FAN
    • Fans with tachometer monitoring
    • Status monitor for speed control
    • Pulse Width Modulated (PWM) fan connectors
    Temperature
    • Monitoring for CPU and chassis environment
    • Thermal Control for fan connectors
    Chassis
    Form Factor
    • 2U Short Depth Rackmount
    Model
    • CSE-219ULTS-R1K30P-NEBS
     
    Dimensions and Weight
    Width
    • 17.2" (432mm)
    Height
    • 3.5" (89mm)
    Depth
    • 22.6" (574mm)
    Weight
    • Net Weight: 35 lbs (16 kg)
    • Gross Weight: 56.5 lbs (25.6 kg)
    Available Colors
    • Silver
     
    Front Panel
    Front Bezel
    • 2U Front Bezel
    • Replaceable UL900-2004 certified air filter
    Buttons
    • Power On/Off button
    • System Reset button
    LEDs
    • Power status LED
    • HDD activity LED
    • Network activity LEDs
    • System information (overheat/UID) LED
     
    Expansion Slots
    PCI-Express
    • 2 PCI-E 3.0 x16 (FH, 10.5"L)
    • 4 PCI-E 3.0 x8 (FH, 10.5"L)
    • 1 PCI-E 3.0 x8 (LP)
    • 1 PCI-E 3.0 x8 (int)


    • (Both CPUs need to be installed for full access to PCI-E slots and onboard controllers. See manual block diagram and AOC Support for details.)
     
    Drive Bays / Storage
    Hot-swap
    • 6 Hot-swap 2.5" drive bays, 6 NVMe/SATA ports (NVMe from CPU1) or 6 SATA ports; Optional SAS support via SAS storage controller

      Note: SAS3 or NVMe support requires additional optional parts
    M.2
    • 1 M.2 PCI-E 3.0 x4 M-Key NVMe (2240/2260/2280/22110) or 1 M.2 M-Key SATA3 (2240/2260/2280/22110) via optional parts
    • 2 M.2 PCI-E 3.0 x4 M-Key NVMe (2260/2280/22110) via optional add-on card AOC-SLG3-2M2
     
    System Cooling
    Fans
    • 6 Hot-swap Heavy duty fans with optimal fan speed control
    Air Shroud
    • 1 Set of Air Shroud
     
    -48Vdc Input Redundant Power Supplies
    1300W DC48V Redundant Power Supplies
    Total Output Power
    • 1300W: -44Vdc to -65Vdc
    Dimension
    (W x H x L)
    • 73.5 x 40 x 265 mm
    +12V
    • Max: 108.3A / Min: 0A (-44 to -65Vdc)
    +12Vsb
    • Max: 2.1A / Min: 0A
    Output Type
    • 25 pair Gold Finger
     
    Operating Environment
    RoHS
    • RoHS Compliant
    Environmental Spec.
    • Operating Temperature:
         Continuous: 5°C ~ 40°C (41°F ~ 104°F)
         Short term: -5°C ~ 55°C (23°F ~ 131°F)
    • Non-operating Temperature:
         -40°C to 70°C (-40°F to 158°F)
    • Operating Relative Humidity:
         5% to 85% with excursion of
         5% to 93% (non-condensing)
    • Non-operating Relative Humidity:
         5% to 95% (non-condensing)

    Parts List
    NEBS Tested Parts List
      Part Number Qty Description
    CPU P4X-CLX6240R-SRGZ8 2 CLX 6240R 2P 24C/48T 2.4G 35.75M 10.4GT 165W 3647 B1
    Memory MEM-DR464L-CL01-ER29
    MEM-DR464L-HL02-ER29
    MEM-DR432L-HL01-ER29
    MEM-DR432L-SL01-ER29
    MEM-DR432L-CL01-ER29
    MEM-DR416L-CL01-ER29
    MEM-DR416L-HL04-ER29
    2
    2
    2
    4
    2
    6
    6
    Micron 64GB DDR4-2933 2RX4 (16Gb) LP ECC RDIMM
    Hynix 64GB DDR4-2933 2Rx4 (16Gb) ECC RDIMM
    Hynix DDR4 1.2V 2933 ECC REG, 32GB DIMM
    Samsung DDR4 1.2V 2933 ECC REG, 32GB DIMM
    Micron DDR4 1.2V 2933 ECC REG, 32GB DIMM
    16GB DDR4-2933 2RX8 LP ECC RDIMM
    16GB DDR4-2933 2Rx8 ECC REG DIMM
    Hard Drives HDS-SUN1-MZQLB7T6HMLA07
    HDS-IUN0-SSDPE2KE076T8
    HDS-MUN-MTFDHAL7T6TDP1AT
    HDS-I2T0-SSDSC2KG076T8
    HDS-S2T1-MZ7LH3T8HMLT05
    HDS-M2T-MTFDDAK7T6TDS1AW
    1 Samsung PM983 7.68TB NVMePCIe3x4 V4TLC 2.5"7mm(1.3 DWPD)
    Intel DC P4610 7.6TB NVMe PCIe3.1 3D TLC 2.5" 3DWPD Rev.1
    Micron 9300 PRO 7.6TB NVMe PCIe 3.0 3D TLC U.2 15mm
    Intel D3-S4610 7.68TB SATA6Gb/s3DTLC 2.5"7mm 3DWPD Rev.2
    Samsung PM883 3.84TB SATA 6Gb/s V4 TLC 2.5" 7mm (1.3 DWPD)
    Micron 5300 PRO 7.68TB,SATA,2.5",3D TLC,0.6DWPD
    GPUs GPU-NVTT4
    GPU-NVTV100S-32
    GPU-FPGA-INNVVN3000-3
    1 NVIDIA Tesla T4 16GB GDDR6 PCIe 3.0 – Passive Cooling 70
    Tesla V100S 32
    Intel N3000-N FPGA
    Add on Cards AOC-S3108L-H8iR-16DD
    AOC-STG-I2T
    AOC-2UR68-m2TS-P
    AOC-SLG3-2E4R
    AOM-TPM-9670H-S
    AOC-2UR66-I4G
    AOC-2UR66-I4XTF
    AOC-S100G-M2C-O
    1 Boardcom 3108L SAS controller
    Intel® X540 2-port RJ45 10GbE Gen3 x8 Standard Low profile
    2U Ultra 2-port 25G SFP28, 1x PCI-E 3.0 x8 (internal)
    LP, PCIe3 x8, 2 internal Mini-SAS HD port redriver NVMe card
    TCG 2.0 compliant trusted platform module (TPM), Horizontal FF
    2U Ultra Riser with 4 GbE ports and 2 PCI-E x16 3.0, Intel i350
    2U Ultra Riser 4-port 10GBase-T, Intel XL710-BM1 and X557-AT4
    Standard low-profile adapter card based on Mellanox ConnectX-4 chipset; two QSFP28 100Gpbs Ethernet ports, PCI-E 3.0 x16 host interface,RoHS
    NVMe PCI-E HDS-MMN-MTFDHBA256TCK1AS 1 Micron 2200 256GB NVMe PCIe3.0x4 TLC M.2 22x80mm
    Fan FAN-0214L4 6 60x60x56 mm, Counter-rotating Cooling Fan for 2U Ultra Short Depth Series Servers
    Power Supplies PWS-1K30D-1R 2 1U 1300W -48Vdc single output power supply gold Level, Redundant