X11DPD-M25

Key Features

• 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
• Intel® C621
• Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only)
• 1 PCI-E 3.0 x16 (Low Profile),
1 PCI-E 3.0 x8 Right Riser Slot,
2 PCI-E 3.0 x8 Proprietary Slot,
1 PCI-E 3.0 x16 Left Riser Slot,
1 PCI-E 3.0 x16 for Add-On-Module (AOM)
M.2 Interface: 1 PCI-E 3.0 x4 and 1 PCI-E 3.0 x1
M.2 Form Factor: 2280
M.2 Key: M-Key
U.2 Interface: 2 PCI-E 3.0 x4,
2 PCI-E 3.0 NVMe x4 Internal Port(s)
• 1 VGA port
• Intel® C621 controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10
• Dual LAN with SoC
Mellanox CONNECTX-4 LX EN 25GbE

Specifications


Product SKUs

MBD-X11DPD-M25	X11DPD-M25


Physical Stats

Form Factor	Proprietary
Dimensions	12" x 13" (30.48cm x 33.02cm)


Processor/Cache

CPU	2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s


System Memory

Memory Capacity	Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Memory Type	2933/2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes	RDIMM: 64GB, 128GB LRDIMM: 64GB, 128GB 3DS LRDIMM: 128GB, 256GB
Memory Voltage	1.2V
Error Detection	Corrects single-bit errors Detects double-bit errors (using ECC memory)


On-Board Devices

Chipset	Intel® C621
SATA	Intel® C621 controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI	ASPEED AST2500
Network Controllers	Dual LAN with SoC Mellanox CONNECTX-4 LX EN 25GbE
Graphics	Aspeed AST2500 BMC


Input / Output

USB	2 USB 2.0 ports (2 via headers) 2 USB 3.2 Gen1 ports (2 rear)
Video Output	1 VGA port
Serial Port / Header	, MicroUSB
TPM	1 TPM Header

Expansion Slots

PCI-E	1 PCI-E 3.0 x16 (Low Profile), 1 PCI-E 3.0 x8 Right Riser Slot, 2 PCI-E 3.0 x8 Proprietary Slot, 1 PCI-E 3.0 x16 Left Riser Slot, 1 PCI-E 3.0 x16 for Add-On-Module (AOM) (Both CPUs need to be installed for full access to PCI-E slots and onboard controllers. See manual block diagram and AOC Support for details.)
M.2	M.2 Interface: 1 PCI-E 3.0 x4 and 1 PCI-E 3.0 x1 Form Factor: 2280 Key: M-Key


System BIOS

BIOS Type	UEFI 256Mb


Management

Software	Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, SPM, SSM, SUM, SuperDoctor® 5, Watchdog


PC Health Monitoring

Voltage	+1.8V, +12V, +3.3V, +5V, +5V standby, Memory Voltages, Monitors CPU voltages
FAN	6x 4-pin fan headers (up to 6 fans), 6 fans with tachometer status monitoring, PWM fan speed control, Status monitoring for speed control
Temperature	CPU thermal trip support, Monitoring for CPU and chassis environment
LED	CPU / System Overheat LED, UID/Remote UID, BMC/IPMI Heartbeat LED, Power LED
Other Features	Chassis intrusion detection, Control of power-on for recovery from AC power loss, CPU thermal trip support for processor protection, Node Manager Support, RoHS, UID


Operating Environment

Operating Temperature Range	10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range	-40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range	8% - 90% (non-condensing)
Non-Operating Relative Humidity Range	5% - 95% (non-condensing)

Parts List

Parts List (Bulk Package)
Name	Part Number	Qty	Description
Motherboard	MBD-X11DPD-M25	1	X11DPD-M25 Motherboard

Chassis (Optimized for

X11DPD-M25

)

Embedded Compact	1U	2U	3U	Mid/Mini-Tower	4U/Tower
	SC802TS-R804AMP	SCLA26TS-R1K62AMBP SCLA26TS-R751AMAP

= Most optimized Chassis for SuperServer Configuration
Blue color = Compatible
Green color = Global SKU & Compatible
Red dot & green color = Optimized + Global SKU

Server (Optimized for X11DPD-M25)

Server Name

슈퍼마이크로 슈퍼마이크로는 기업 컴퓨팅, 스토리지, 네트워킹 솔루션 및 그린 컴퓨팅 기술 분야의 글로벌 리더입니다.

X11DPD-M25

Key Features

Specifications

Parts List

X11DPD-M25