X11DPT-B
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Key Features
- • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
- • Intel® C621
- • Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz
Or 6TB DCPMM, DDR4-2666MHz, in 24 DIMM slots;
Up to 6TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only);
- • 1 PCI-E 3.0 x16 Left Riser Slot,
1 PCI-E 3.0 x16 Right Riser Slot
1 PCI-E 3.0 x24 Proprietary Slot (for Supermicro storage add-on card),
1 PCI-E 3.0 x16 SIOM LAN Networking Slot,
1 PCI-E 3.0 x8 Proprietary Slot (For M.2 add-on card)
- • 1 VGA port
- • Intel® C621 controller for SATA3 (6 Gbps) ports; RAID 0,1,5,10
- • Single LAN with
Networking options provided via SIOM module
Specifications
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Parts List
| Parts List (Bulk Package) | |||
| Name | Part Number | Qty | Description |
| Motherboard | MBD-X11DPT-B | 1 | X11DPT-B Motherboard |
| -- | |||
| Optional Parts List | |||
| Name | Part Number | Qty | Description |
| TPM security module (optional, not included) | AOM-TPM-9670V | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |
| TPM security module (optional, not included) | AOM-TPM-9670H | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor |
| TPM security module (optional, not included) | AOM-TPM-9671V | 1 | SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor |
| TPM security module (optional, not included) | AOM-TPM-9671H | 1 | SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor |
Chassis
(Optimized for
X11DPT-B
)| Embedded Compact | 1U | 2U | 3U | Mid/Mini-Tower | 4U/Tower |
 SC217BHQ+-R2K22BP 1U Heatsink:SNK-P0067PSM (Front) 1U Heatsink:SNK-P0067PS (Rear) |
= Most optimized Chassis for SuperServer Configuration
Blue color = Compatible
Green color = Global SKU & Compatible
Red dot & green color = Optimized + Global SKU
Server (Optimized for X11DPT-B)