X11DPH-Tq
PrintKey Features
- • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
- • Intel® C627
- • Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz
Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
- • 3 PCI-E 3.0 x16,
3 PCI-E 3.0 x8
M.2 Interface: 2 PCI-E 3.0 x4
M.2 Form Factor: 2242/2260/2280/22110
M.2 Key: M-Key (RAID 0,1 support)
- • 1 VGA port
- • Intel® C627 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- • Dual LAN with 10GBase-T with Intel® X722 + X557
Specifications
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Parts List
Parts List (Bulk Package) | |||
Name | Part Number | Qty | Description |
Motherboard | MBD-X11DPH-Tq | 1 | X11DPH-Tq Motherboard |
I/O Shield | MCP-260-00042-0N | 1 | STD I/O SHIELD |
I/O Cables | CBL-0044L | 2 | 57.5 cm SATA FLAT S-S PBF |
Chassis
(Optimized for
X11DPH-Tq
)Embedded Compact | 1U | 2U | 3U | Mid/Mini-Tower | 4U/Tower |
SC826BE1C4-R1K23LPB SC826BE1C4-R1K23LPB SC829HE1C4-R1K62LPB SC829HE1C4-R1K62LPB SC216BE1C4-R1K23LPB SC216BE1C4-R1K23LPB SCLA26E1C4-R609LP 2U Heatsink:SNK-P0068PSC (Front) 2U Heatsink:SNK-P0068PS (Rear) |
SC836BE1C-R1K23B SC835TQC-R1K03B 2U Heatsink:SNK-P0068PS |
SC846BE1C-R1K23B 2U Heatsink:SNK-P0068PS SC847BE1C4-R1K23LPB 2U Heatsink:SNK-P0068PSC (Front) 2U Heatsink:SNK-P0068PS (Rear) |
= Most optimized Chassis for SuperServer Configuration
Blue color = Compatible
Green color = Global SKU & Compatible
Red dot & green color = Optimized + Global SKU
Blue color = Compatible
Green color = Global SKU & Compatible
Red dot & green color = Optimized + Global SKU