X11DPL-i
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Key Features
- • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 140W TDP, 2 UPI up to 10.4 GT/s
- • Intel® C621
- • Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
- • 2 PCI-E 3.0 x16,
3 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8 slot)
M.2 Interface: 1 SATA/PCI-E 3.0 x4
M.2 Form Factor: 2260, 2280
M.2 Key: M-Key
- • 1 VGA port
- • Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- • Dual LAN with Intel® X550 10GBase-T Ethernet Controller
Specifications
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Parts List
Parts List (Bulk Package) | |||
Name | Part Number | Qty | Description |
Motherboard | MBD-X11DPL-i | 1 | X11DPL-i Motherboard |
I/O Cables | CBL-0044L | 2 | SATA CABLE 61CM FLAT S-S PBF |
I/O Shield | MCP-260-00110-0N | 1 | Standard I/O Shield for X11DPL-i with EMI Gasket |
Parts List (Retail Package) | |||
Name | Part Number | Qty | Description |
Motherboard | MBD-X11DPL-i | 1 | X11DPL-i Motherboard |
I/O Cables | CBL-0044L | 6 | SATA CABLE 61CM FLAT S-S PBF |
I/O Shield | MCP-260-00110-0N | 1 | Standard I/O Shield for X11DPL-i with EMI Gasket |
Optional Parts List | |||
Name | Part Number | Qty | Description |
Heat Sink (optional, not included) | SNK-P0067PD | -- | 1U Passive Proprietary CPU Heat Sink for X11DPL Motherboard Equipped with a Square Retention Mechanism |
Heat Sink (optional, not included) | SNK-P0068AP4 | -- | 2U Active CPU Heat Sink Supporting Square Bolster Plate Mounting Mechanism for X11DPL in 2U and Above Systems |
TPM security module (optional, not included | AOM-TPM-9670V | -- | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |
1U I/O Shield | MCP-260-00111-0N | -- | 1U I/O Shield for X11DPL-i with EMI Gasket |
Chassis
(Optimized for
X11DPL-i
)Embedded Compact | 1U | 2U | 3U | Mid/Mini-Tower | 4U/Tower |
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Blue color = Compatible
Green color = Global SKU & Compatible
Red dot & green color = Optimized + Global SKU
Server (Optimized for X11DPL-i)