슈퍼솔루션
Servers & StorageBuilding BlocksloT & EmbeddedWorkstations
Servers & StorageBuilding BlocksloT & EmbeddedWorkstations

슈퍼마이크로 슈퍼마이크로는 기업 컴퓨팅, 스토리지, 네트워킹 솔루션 및 그린 컴퓨팅 기술 분야의 글로벌 리더입니다.

    SYS-F629P3-RC0B

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    Intergrated Board
    X11DPFR-SN
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    Key Features

    • 4 Hot-plug System Nodes in 4U
      Each node supports:
    • 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
    • 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM,
      Supports Intel® Optane™ DCPMM††
    • 3. Expansion slots: 1 PCI-E 3.0 x16 (LP)
      1 PCI-E 3.0 x16 (for SIOM )
    • 4. SIOM Network card,
      1 dedicated IPMI LAN port
    • 5. 1 VGA, 2 USB 3.0 ports

    • 6. 8 Hot-swap 3.5" SAS3/SATA3 or 6 Hot-swap 3.5" SAS3/SATA3 + 2 optional NVMe U.2
      M.2 Interface: PCI-E 3.0 x4
      M.2 Form Factor: 2260, 2280, 22110
      M.2 Key: M-Key
    • 7. SAS3 via Broadcom 3008
    • 8. 2x 8cm 14k RPM middle fans
    • 9. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)
    Specifications
    Product SKUs
    SYS-F629P3-RC0B
    • SuperServer F629P3-RC0B (Black)
     
    Motherboard

    Super X11DPFR-SN
     
    Processor/Cache (per Node)
    CPU
    • Dual Socket P (LGA 3647)
    • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
      Dual UPI up to 10.4GT/s
    • Support CPU TDP 70-165W with IVR
    Cores
    • Up to 28 Cores
    Note ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R).
     
    Extended thermal solutions may be required to support CPUs higher than 165W TDP, please contact Supermicro Technical Support for additional information.
     
    System Memory (per Node)
    Memory Capacity
    • 12 DIMM slots
    • Up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
    • Supports Intel® Optane™ DCPMM††
    Memory Type
    • 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
    Note † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
    †† Cascade Lake only. Contact your Supermicro sales rep for more info.
     
    On-Board Devices
    Chipset
    • Intel® C621 chipset
    SAS
    • SAS3 (12Gbps) via Broadcom 3008
    Network Controllers
    • Flexible networking via SIOM
    IPMI
    • Support for Intelligent Platform Management Interface v.2.0
    • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
    Graphics
    • ASPEED AST2500 BMC
     
    Input / Output (per node)
    SAS
    • 8 SAS3 (12Gbps) ports
    NVMe
    • 2 NVMe U.2 option
    LAN
    • SIOM flexible Network card
    • 1 RJ45 Dedicated IPMI LAN port
    USB
    • 2 USB 3.0 ports (rear)
    VGA
    • 1 VGA port
     
    System BIOS
    BIOS Type
    • 128Mb SPI Flash EEPROM with AMI BIOS
     
    Management
    Software
    Power Configurations
    • ACPI Power Management
     
    PC Health Monitoring
    CPU
    • Monitors for CPU Cores, Chipset Voltages, Memory.
    • 4+1 Phase-switching voltage regulator
    FAN
    • Fans with tachometer monitoring
    • Status monitor for speed control
    • Pulse Width Modulated (PWM) fan connectors
    Temperature
    • Monitoring for CPU and chassis environment
    • Thermal Control for fan connectors
    Chassis
    Form Factor
    • 4U Rackmount
    Model
    • CSE-F424AS2-R1K23BP
     
    Dimensions and Weight
    Width
    • 17.63" (448mm)
    Height
    • 6.96" (177mm)
    Depth
    • 29" (737mm)
    Package
    • 28.3" (W) x 15.0" (H) x 42.4" (D)
    Weight
    • Net Weight: 150 lbs (68.04 kg)
    • Gross Weight: 200 lbs (90.71 kg)
    Available Colors
    • Black
     
    Front Panel
    Buttons
    • Power On/Off button
    • UID button
    LEDs
    • Power status LED
    • Hard drive activity LED
    • Network activity LEDs
    • Information LED (UID, Fan failure, Overheat)
     
    Expansion Slots (per node)
    PCI-Express
    • 1 PCI-E 3.0 x16 (Low-profile)
    • 1 PCI-E 3.0 x16 (SIOM)
     
    Drive Bays (per node)
    Hot-swap
    • 8 Hot-swap 3.5" SAS3/SATA3 or 6 Hot-swap 3.5" SAS3/SATA3 + 2 optional NVMe U.2
    M.2
    • M.2 Interface: PCI-E 3.0 x4
    • M.2 Form Factor: 2260, 2280, 22110
    • M.2 Key: M-Key
     
    Backplane
    1 SAS/SATA backplane
     
    System Cooling (per node)
    Fans
    • 2x 8cm 14 RPM middle fans
     
    Power Supply (76mm Width)
    1200W Redundant Power Supplies with PMBus
    Total Output Power
    • 1000W/1200W
    Dimension
    (W x H x L)
    • 76 x 40 x 336 mm
    Input
    • 100-127Vac / 15-12A / 50-60Hz
    • 200-240Vac / 8.5-7A / 50-60Hz
    • 200-240Vdc / 8.5-7A (for CCC only)
    +12V
    • Max: 83A / Min: 0A (100-127Vac)
    • Max: 100A / Min: 0A (200-240Vac)
    • Max: 100A / Min: 0A (200-240Vdc)
    +5Vsb
    • Max: 4A / Min: 0A
    Output Type
    • 19 Pairs Gold Finger Connector
    Certification Platinum Level Certified95%+ Titanium Level
      [ Test Report ]
     
    Operating Environment
    RoHS
    • RoHS Compliant
    Environmental Spec.
    • Operating Temperature:
         10°C ~ 35°C (50°F ~ 95°F)
    • Non-operating Temperature:
         -40°C to 60°C (-40°F to 140°F)
    • Operating Relative Humidity:
         8% to 90% (non-condensing)
    • Non-operating Relative Humidity:
         5% to 95% (non-condensing)

    Parts List
    Parts List - (Items Included)
     
    		 Part Number
    		 Qty
    		 Description
    Motherboard / Chassis MBD-X11DPFR-SN
    CSE-F424AS2-R1K23BP     		4
    1    		 Super X11DPFR-SN Motherboard
    4U Chassis
    Backplane BPN-ADP-8S3008-1UF 4 BPN-ADP-8S3008-1UF
    Backplane BPN-ADP-X11DPFR 4 Power distribution board for X11DPFR-S(N)
    Backplane BPN-SAS3-F424-A2N2A 4 2-Port Hybrid Backplane support 2 x SAS3/SATA3/NVMe Storage Devices
    Backplane BPN-SAS3-F424-A6 4 6-port Fat Twin SAS3 12Gbps backplane, support up to 6x 3.5-inch SAS3/SATA3 HDD/SSD
    Cable 1 CBL-0486L 12 2x2 to 2x2 15cm power cable HF. 18AWG
    Cable 2 CBL-OTHR-0022L 4 20 to 20 pin cable for BPN-ADP-F418LS,7.5cm, 28AWG,RoHS/REACH,PBF
    Cable 3 CBL-PWCD-0900 4 PWCD,US/EU/Canada/China/Australia,IEC60320 C14 TO C13,4FT,17AWG
    Cable 4 CBL-SAST-0691 4 MINI SAS HD RA- 2x MINI SAS HD,INT,15/59CM,28AWG
    Cable 5 CBL-SAST-0706 4 MINI SAS HD (reversed RA)-MINI SAS HD,12G,INT,11CM,30AWG
    Heatsink / Retention SNK-P0068PSC 4 2U Passive CPU Heat Sink with a Side Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
    Heatsink / Retention SNK-P0069PSC 4 1.5U Proprietary 50-mm Tall Passive CPU Heat Sink with a Side Air Channel for X11 Purley Platform 2U Node Twin Series Servers
    Power Supply PWS-1K23A-1R 4 AC-DC 1200W, Titanium Level, Redundancy, 1U, PMBUS 1.2, +12V/+5Vsb, 360x76x40 mm,HF,RoHS/REACH
    Optional Parts List
      Part Number Qty Description
    Backplane BPN-ADP-2UPWR-X11 - 1 per node for configurations with CPU at 145W or higher
    Cable CBL-0480L - 1 per node for configurations with CPU at 145W or higher
    NVMe - - Contact Supermicro for configurations with more NVMe SSDs.
    Software SFT-OOB-LIC 1 OOB Management Package (per node license)
    Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
    Hide Parts List
    서울시 금천구 벚꽃로 244 707호, 1107호~1110호, 1113호,1114호 [벽산디지털밸리5차]
    대표이사 김성현
    대표번호 : 1661-6560
    팩스번호 : 02-2082-5543
    제품 및 기술문의 : 070-4055-1414
    E-mail : sales@supersolution.co.kr