슈퍼솔루션

슈퍼마이크로 슈퍼마이크로는 기업 컴퓨팅, 스토리지, 네트워킹 솔루션 및 그린 컴퓨팅 기술 분야의 글로벌 리더입니다.

    SYS-F619P3-FT

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    Key Features

    • - Compute Intensive Applications
      - Data Center, HPC and Enterprise Applications
      - Hyperscale, Hyperconverged
      - 4U 8 node system, each node:
    • 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
    • 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM,
      Supports Intel® Optane™ DCPMM††
    • 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (LP),
      1 PCI-E 3.0 x16 (for SIOM )
    • 4. 2 Fixed 3.5" SATA3 drive bays
      M.2 Interface: 2 SATA/PCI-E 3.0 x4, RAID 0 and 1
      M.2 Form Factor: 2260, 2280, 22110
      M.2 Key: M-Key
    • 5. Dual GbE ports via SIOM Network card,
      1 dedicated IPMI LAN port (front)
    • 6. 1 VGA, 2 USB 3.0 ports (front)
    • 7. 8x 8cm 13.5k RPM rear fans per enclosure
    • 8. 2200W Redundant Power Supplies Titanium Level (96% Efficiency)
    Specifications
    Product SKUs
    SYS-F619P3-FT
    • SuperServer F619P3-FT (Black)
     
    Motherboard

    Super X11DPFF-SN
     
    Processor/Cache (per Node)
    CPU
    • Dual Socket P (LGA 3647)
    • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
      Dual UPI up to 10.4GT/s
    • Support CPU TDP 70-165W with IVR
    Cores
    • Up to 28 Cores
    Note BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R).
     
    Extended thermal solutions may be required to support CPUs higher than 165W TDP, please contact Supermicro Technical Support for additional information.
     
    System Memory (per Node)
    Memory Capacity
    • 12 DIMM slots
    • Up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
    • Supports Intel® Optane™ DCPMM††
    Memory Type
    • 2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
    Note 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
    †† Cascade Lake only. Contact your Supermicro sales rep for more info.
     
    On-Board Devices
    Chipset
    • Intel® C621 chipset
    SATA
    • SATA3 (6Gbps); RAID 0, 1, 5, 10
    Network Controllers
    • Flexible networking via SIOM
    IPMI
    • Support for Intelligent Platform Management Interface v.2.0
    • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
    Graphics
    • ASPEED AST2500 BMC
     
    Input / Output (per node)
    SATA
    • 14 SATA3 (6Gbps) ports
    LAN
    • SIOM flexible Network card
    • 1 RJ45 Dedicated IPMI LAN port (front)
    USB
    • 2 USB 3.0 ports (front)
    VGA
    • 1 VGA port (front)
     
    System BIOS
    BIOS Type
    • 128Mb SPI Flash EEPROM with AMI BIOS
     
    Management
    Software
    Power Configurations
    • ACPI Power Management
     
    PC Health Monitoring
    CPU
    • Monitors for CPU Cores, Chipset Voltages, Memory.
    • 4+1 Phase-switching voltage regulator
    FAN
    • Fans with tachometer monitoring
    • Status monitor for speed control
    • Pulse Width Modulated (PWM) fan connectors
    Temperature
    • Monitoring for CPU and chassis environment
    • Thermal Control for fan connectors
    Chassis
    Form Factor
    • 4U Rackmount
    Model
    • CSE-F418IF3-R2K20BP
     
    Dimensions and Weight
    Width
    • 17.63" (448mm)
    Height
    • 6.96" (177mm)
    Depth
    • 29" (737mm)
    Package
    • 28.3" (W) x 15.0" (H) x 42.4" (D)
    Weight
    • Net Weight: 150 lbs (68.04 kg)
    • Gross Weight: 200 lbs (90.71 kg)
    Available Colors
    • Black
     
    Front Panel
    Buttons
    • Power On/Off button
    • UID button
    LEDs
    • Power status LED
    • Network activity LEDs
    • Information LED (Fan failure, Overheat)
     
    Expansion Slots (per node)
    PCI-Express
    • 1 PCI-E 3.0 x16 (Low-profile)
    • 1 PCI-E 3.0 x8 (Low-profile)
    • 1 PCI-E 3.0 x16 (SIOM)
     
    Drive Bays (per node)
    Fixed
    • 2 Fixed 3.5" SATA3 drive bays
    M.2
    • M.2 Interface: 2 SATA/PCI-E 3.0 x4, RAID 0 & 1
    • M.2 Form Factor: 2260, 2280, 22110
    • M.2 Key: M-Key
     
    System Cooling
    Fans
    • 8x 8cm 13.5k RPM rear fans per enclosure
     
    Power Supply
    2200W Redundant Power Supplies with PMBus
    Total Output Power and Input
    • 1200W with Input 100-127Vac
    • 1800W with Input 200-220Vac
    • 1980W with Input 220-230Vac
    • 2090W with Input 230-240Vac
    • 2200W with Input 220-240Vac (for UL/cUL use only)
    • 2090W with Input 230-240Vdc (for CCC only)
    AC Input Frequency
    • 50-60Hz
    Dimension
    (W x H x L)
    • 76 x 40 x 336 mm
    +12V
    • Max: 100A / Min: 0A (100-127Vac)
    • Max: 150A / Min: 0A (200-220Vac)
    • Max: 165A / Min: 0A (220-230Vac)
    • Max: 174.17A / Min: 0A (230-240Vac)
    • Max: 183.3A / Min: 0A (220-240Vac)
    5VSB
    • Max: 1A / Min: 0A
    Output Type
    • Backplanes (gold finger)
    Certification Titanium Level96%  Titanium Level
      [ Test Report ]
     
    Operating Environment
    RoHS
    • RoHS Compliant
    Environmental Spec.
    • Operating Temperature:
         10°C ~ 35°C (50°F ~ 95°F)
    • Non-operating Temperature:
         -40°C to 60°C (-40°F to 140°F)
    • Operating Relative Humidity:
         8% to 90% (non-condensing)
    • Non-operating Relative Humidity:
         5% to 95% (non-condensing)

    Parts List
    Parts List - (Items Included)
     
    Part Number
    Qty
    Description
    Motherboard / Chassis MBD-X11DPFF-SN
    CSE-F418IF3-R2K20BP
    8
    1
    Super X11DPFF-SN Motherboard
    4U Chassis
    Backplane BPN-ADP-X11DPFF 8 Power adapter card for X11DPFF,RoHS
    Cable 1 CBL-CDAT-0910 8 CBL,SGPIO,2X5F TO 2X5F,P2.54, 14CM, 24AWG,RoHS
    Cable 2 CBL-PWCD-0578 4 PWCD,US,IEC60320 C14 TO C13,3FT,14AWG
    Cable 3 CBL-PWEX-1020-11 16 PWEX,2X4F/P4.2 TO 2X4F/P4.2,10.5CM,16AWG,RoHS
    Cable 4 CBL-SAST-0672 8 MINI SAS HD-SAS 29PX2+2x4P,INT,46/56/41/52CM,22/30AWG,RoHS
    Drive Tray(s) MCP-220-00134-0N 16 Tool-less 3.5
    Riser Card RSC-P-6 8 RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
    Riser Card RSC-R1UF-E16R 8 RSC-R1UF-E16R
    Heatsink / Retention SNK-P0067PS 8 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
    Heatsink / Retention SNK-P0067PSC 8 1U Passive CPU Heat Sink with a 17-mm Wide Side Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
    * Power Supply PWS-2K04A-1R 4 AC-DC 2000W, Titanium Level, Redundancy, 1U, PMBus 1.2, +12V/+5Vsb, 360x76x40mm,HF,RoHS/REACH
    * Power Supply PWS-2K20A-1R 4 1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm
    * Backplane BPN-PDB-X11DPFF 2 Power Middleplane for X11 FIO Fattwin,RoHS
    * Rail Set MCP-290-41803-0N 1 Fat twin F418 / F424 Static Rail set support 28-33.5 inch depth rail,RoHS/REACH,PBF
    Notes:
    1. Parts with * are inside the chassis
    2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
    Optional Parts List
      Part Number Qty Description
    Connect 1x 2.5" NVMe Drive CBL-SAST-0950 1/node 2x OcuLink v 1.0 to 2x PCIe SFF-8639 w/ Power, 35/57CM, 32/24/20 AWG
    RAID Card AOC-S3108L-H8IR-16DD - LSI 3108 8 int 12Gb/s ports, 8xGen3, ROC - LP,16 HDD
    Software SFT-OOB-LIC 1 OOB Management Package (per node license)
    Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
    Hide Parts List

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    팩스번호 : 02-2082-5543
    제품 및 기술문의 : 070-4055-1414
    E-mail : sales@supersolution.co.kr