슈퍼솔루션

슈퍼마이크로 슈퍼마이크로는 기업 컴퓨팅, 스토리지, 네트워킹 솔루션 및 그린 컴퓨팅 기술 분야의 글로벌 리더입니다.

    SYS-2029TP-HC0R

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    Key Features

    • - Compute Intensive Application
      - HPC, Data Center
      - Enterprise Server
      - Financial Analysis
      - Mission-critical applications

    • /Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
    • 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
    • 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM,
      Supports Intel® Optane™ DCPMM††
    • 3. 2 PCI-E 3.0 x16 (LP) slots
    • 4. Flexible Networking support via SIOM;
      Dedicated IPMI 2.0 LAN
    • 5. 6 Hot-swap 2.5" SAS/SATA drive bays
    • 6. Broadcom 3008 SAS3 controller;
      RAID 0, 1, 1E/10
    • 7. Mini-mSATA (half size) support on 3008 backplane
    • 8. Up to 2200W Redundant Power Supplies Titanium Level (96%)
    Specifications
    Product SKUs
    SYS-2029TP-HC0R
    • SuperServer 2029TP-HC0R (Black)
     
    Motherboard (Four per System)

    Super X11DPT-PS
     
    Processor/Cache (per Node)
    CPU
    • Dual Socket P (LGA 3647)
    • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
      Dual UPI up to 10.4GT/s
    • Support CPU TDP 70-165W*
    Cores
    • Up to 28 Cores
    Note * Please contact Supermicro Technical Support for supporting conditions of high power (TDP 150W and above) or high base frequency (3.0 GHz and above) processors.
    Note ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
     
    System Memory (per Node)
    Memory Capacity
    • 16 DIMM slots
    • Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
    • Supports Intel® Optane™ DCPMM††
    Memory Type
    • 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
    Note † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
    †† Cascade Lake only. Contact your Supermicro sales rep for more info.
     
    On-Board Devices (per Node)
    Chipset
    • Intel® C621 chipset
    SAS
    • Broadcom 3008 SAS3 (12Gbps) controller;
         RAID 0, 1, 1E/10 support
    Network Controllers
    • Barebones and Complete System must have at least one SIOM or network card installed per node
    IPMI
    • Support for Intelligent Platform Management Interface v.2.0
    • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
    Graphics
    • ASPEED AST2500 BMC
     
    Input / Output (per Node)
    SAS
    • 6 SAS3 (12Gbps) ports
    LAN
    • 1 RJ45 Dedicated IPMI LAN port
    USB
    • 2 USB 3.0 ports (rear)
    VGA
    • 1 VGA port
    Serial Port / Header
    • 1 Fast UART 16550 port / 1 Header (internal)
    Others
    • 2 SuperDOM support on the motherboard
    • 1 NVMe or 2 SATA M.2 (22x80/60/42 mm) support with option part: AOC-SMG3-2H8M2
    • M.2 and SuperDOM are for OS boot and they cannot coexist
     
    System BIOS
    BIOS Type
    • AMI 32MB SPI Flash ROM
     
    Management
    Software
    Power Configurations
    • ACPI Power Management
     
    PC Health Monitoring
    CPU
    • Monitors for CPU Cores, Chipset Voltages, Memory.
    • 5+1 Phase-switching voltage regulator
    FAN
    • Fans with tachometer monitoring
    • Status monitor for speed control
    • Pulse Width Modulated (PWM) fan connectors
    Temperature
    • Monitoring for CPU and chassis environment
    • Thermal Control for fan connectors
    Omni-Path Fabric CPUs
    • Do not support
    Chassis
    Form Factor
    • 2U Rackmount
    Model
    • CSE-217HQ+-R2K20BP3
     
    Dimensions and Weight
    Width
    • 17.25" (438mm)
    Height
    • 3.47" (88mm)
    Depth
    • 28.5" (724mm)
    Weight
    • Gross Weight: 90 lbs (40.9kg)
    • Net Weight: 72 lbs (32.7 kg)
    Available Colors
    • Black
     
    Front Panel
    Buttons
    • Power On/Off button
    • UID button
    LEDs
    • Power status LED
    • HDD activity LED
    • Network activity LEDs
    • Universal Information (UID) LED
     
    Expansion Slots (per Node)
    PCI-Express
    • 2 PCI-E 3.0 x16 Low-profile slots
    • 1 SIOM card support

      Note: Barebones and Complete System must bundle with Network Card


    • (With only one CPU installed, SXB2 M.2 and SXB4 riser card slots not function)
     
    Drive Bays (per Node)
    Hot-swap
    • 6 Hot-swap 2.5" SAS/SATA HDD trays
     
    System Cooling
    Fans
    • 4 Heavy duty 8cm PWM fans with optimal fan speed control
     
    Power Supply
    2200W Redundant Power Supplies with PMBus
    Total Output Power and Input
    • 1200W with Input 100-127Vac
    • 1800W with Input 200-220Vac
    • 1980W with Input 220-230Vac
    • 2090W with Input 230-240Vac
    • 2200W with Input 220-240Vac (for UL/cUL use only)
    • 2090W with Input 230-240Vdc (for CCC only)
    AC Input Frequency
    • 50-60Hz
    Dimension
    (W x H x L)
    • 76 x 40 x 336 mm
    +12V
    • Max: 100A / Min: 0A (100-127Vac)
    • Max: 150A / Min: 0A (200-220Vac)
    • Max: 165A / Min: 0A (220-230Vac)
    • Max: 174.17A / Min: 0A (230-240Vac)
    • Max: 183.3A / Min: 0A (220-240Vac)
    5VSB
    • Max: 1A / Min: 0A
    Output Type
    • Backplanes (gold finger)
    Certification Titanium Level96%  Titanium Level
      [ Test Report ]
     
    Operating Environment
    RoHS
    • RoHS Compliant
    Environmental Spec.
    • Operating Temperature:
         10°C ~ 35°C (50°F ~ 95°F)
    • Non-operating Temperature:
         -40°C to 60°C (-40°F to 140°F)
    • Operating Relative Humidity:
         8% to 90% (non-condensing)
    • Non-operating Relative Humidity:
         5% to 95% (non-condensing)

    Parts List
    Parts List - (Items Included)
     
    Part Number
    Qty
    Description
    Motherboard / Chassis MBD-X11DPT-PS
    CSE-217HQ+-R2K20BP3
    4
    1
    Super X11DPT-PS Motherboards
    2U Chassis
    Backplane BPN-ADP-S3008L-L6IP 4 LSI 3008, SAS 12Gbs (X6 port inside)
    Backplane BPN-SAS3-217HQ2 1 2U 24-Port 4-Node Backplane Supports 6x2.5
    Cable 1 CBL-PWCD-0578 2 PWCD,US,IEC60320 C14 TO C13,3FT,14AWG
    Air Shroud MCP-310-21716-0B 4 Twinpro X11 air shroud
    Riser Card RSC-P-6 4 RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
    Riser Card RSC-R1UTP-E16R 4 1U RHS TwinPro Riser card with one PCI-E x16 slot
    Heatsink / Retention SNK-P0067PS 4 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
    Heatsink / Retention SNK-P0067PSM 4 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
    Power Supply PWS-2K20A-1R 2 1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm
    Optional Parts List
      Part Number Qty Description
    TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
    TPM security module (optional, not included) AOM-TPM-9671V 1 SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
    Add-on-Card AOC-SMG3-2H8M2 - AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA),
    FST-SCRW-0121L is included in AOC-SMG3-2H8M2
    Global Services & Support OS4HR3/2/1
    OSNBD3/2/1
    -
    -
    3/2/1-year onsite 24x7x4 service
    3/2/1-year onsite NBD service
    Software SFT-OOB-LIC 1 OOB Management Package (per node license)
    Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
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