슈퍼솔루션

슈퍼마이크로 슈퍼마이크로는 기업 컴퓨팅, 스토리지, 네트워킹 솔루션 및 그린 컴퓨팅 기술 분야의 글로벌 리더입니다.

    H11SSL-C

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    Key Features

    • 1.Single AMD EPYC™ 7001/7002 Series Processor
      (AMD EPYC 7002 series drop-in support requires board revision 2.x)
    • 2.1TB Registered ECC DDR4 2666MHz SDRAM in 8 DIMMs
      2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs (Board revision 2.x required)
    • 3.Expansion slots:
       3 PCI-E 3.0 x16
       3 PCI-E 3.0 x8
       M.2 Interface: 1 PCI-E 3.0 x4
       M.2 Form Factor: 2280, 22110
       M.2 Key: M-key
    • 4.8 SATA 3.0 + Broadcom 3008 for 8 SAS3 ports, 1 M.2
    • 5.Dual Gigabit Ethernet LAN Ports
    • 6.ASPEED AST2500 BMC graphics
    • 7.Up to 5 USB 3.0 ports
       (2 rear + 2 via header + 1 Type A)
      Up to 4 USB 2.0 ports
       (2 rear + 2 via header)
    • 8.7 PWM 4-pin Fans with tachometer status monitoring
    Specifications
    Product SKUs
    MBD-H11SSL-C
    • H11SSL-C
    MBD-H11SSL-C-B
    • H11SSL-C (Bulk Pack)
    MBD-H11SSL-C-O
    • H11SSL-C (Retail Pack)
    Physical Stats
    Form Factor
    • ATX
    Dimensions
    • 12" x 9.6" (30.5cm x 24.4cm)
    Processor/Chipset
    CPU
    • Single AMD EPYC™ 7001/7002* series Processor (*Board revision 2.x required)
    • Socket SP3
    Cores
    • Up to 32 Cores
    • Up to 64 Cores (Board revision 2.x required)
    Chipset
    • System on Chip
    System Memory
    Memory Capacity
    • 8 DIMM slots
    • Supports up to 1TB Registered ECC DDR4 2666MHz SDRAM in 8 DIMMs
    • Supports up to 2TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.x required)
    • 8-channel memory bus
    Memory Type
    • DDR4 2666 MHz Registered ECC, 288-pin gold-plated DIMMs
    • DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs (Board revision 2.x required)
    DIMM Sizes
    • 8GB, 16GB, 32GB, 64GB, 128GB, 256GB* (*Board revision 2.x required)
    Memory Voltage
    • 1.2V
    Error Detection
    • Corrects single-bit errors
    • Detects double-bit errors (using ECC memory)
    On-Board Devices
    SATA
    • SATA3 (6 Gbps)
    SAS
    • Broadcom 3008 SAS3 (12 Gbps) controller
    • RAID 0, 1, 10
    IPMI
    • Support for Intelligent Platform Management Interface v.2.0
    • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
    • ASPEED AST2500 BMC
    Network Controllers
    • 2 1GbE LAN via Intel® I210
    • 1 Realtek RTL8211E PHY (dedicated IPMI)
    VGA
    • ASPEED AST2500 BMC
    Input / Output
    SAS
    • 8 SAS3 (12 Gbps) ports
    SATA
    • 8 SATA3 (6 Gbps) ports
    LAN
    • 2 RJ45 Gigabit Ethernet LAN ports
    • 1 RJ45 Dedicated IPMI LAN port
    USB
    • 5 USB 3.0 ports
      (2 rear + 2 via header + 1 Type A)
    • 4 USB 2.0 ports (2 rear + 2 via header)
    VGA
    • 1 VGA port
    Others
    • 1 COM port (rear)
    • 2 SATA DOM power connector
    • 1 TPM 2.0 header
    Expansion Slots
    PCI-Express
    • 3 PCI-E 3.0 x8
    • 3 PCI-E 3.0 x16
    M.2
    • Interface: PCI-E 3.0 x4
    • Form factor: 2280, 22110
    • Key: M-key
    Chassis ( Optimized for H11SSL-C )
    1U
    2U
    3U
    4U
    Server(s) ( with H11SSL-C )
    Model(s)
    System BIOS
    BIOS Type
    • AMI 128Mb SPI Flash EEPROM
    BIOS Features
    • Plug and Play (PnP)
    • DMI 2.3
    • PCI 2.2
    • ACPI 5.1
    • USB Keyboard Support
    • SMBIOS 3.1.1
    Management
    Software
    Power Configurations
    • ACPI Power Management
    • Power-on mode control for AC power loss recovery
    PC Health Monitoring
    CPU
    • Monitors CPU Core Voltages, +1.8V, +3.3V, +5V, +5V standby, +3.3V standby
    • CPU switching voltage regulator
    • Supports system management utility
    • VBAT
    FAN
    • Up to 7-fan status tachometer monitoring
    • Up to 7 4-pin fan headers
    • Dual Cooling Zone
    • Status monitor for speed control
    • Pulse Width Modulated (PWM) fan connectors
    Temperature
    • Monitoring for CPU and chassis environment
    • CPU Thermal Trip Support
    • Thermal control for 7x Fan connectors
    • I²C Temperature Sensing Logic
    LED
    • CPU / System Overheat LED
    Other Features
    • Chassis Intrusion Detection
    • Chassis Intrusion Header
    • UID
    Operating Environment / Compliance
    Environmental Specifications
    • Operating Temperature:
      10°C to 35°C (50°F to 95°F)
    • Non-operating Temperature:
      -40°C to 70°C (-40°F to 158°F)
    • Operating Relative Humidity:
      8% to 90% (non-condensing)
    • Non-operating Relative Humidity:
      5% to 95% (non-condensing)
    Parts List
    Bulk Pack List
    Part Number Qty Description
    H11SSL-C MBD-H11SSL-C-B 1 H11SSL-C Motherboard
    I/O Cable CBL-0044L 2 57.5CM SATA FLAT S-S PBF
    I/O Shield MCP-260-00042-0N 1 STD I/O SHIELD FOR X9 SOCKET R SERVER MB
    Retail Pack List
    Part Number Qty Description
    H11SSL-C MBD-H11SSL-C-O 1 H11SSL-C Motherboard
    I/O Cable CBL-0044L 2 57.5CM SATA FLAT S-S PBF
    I/O Cable CBL-0658 2 INT Mini-SAS HD CBL for PCIe SSD NVMe 12Gb/s 60cm 30AWG
    I/O Shield MCP-260-00042-0N 1 STD I/O SHIELD FOR X9 SOCKET R SERVER MB
    Optional Parts List
    Part Number Qty Description
    I/O Cable CBL-SAST-0699 - MINI SAS HD-4 SATA,12G,INT,75/75/90/90CM,75CM SB,28/30AWG,Ro
    TPM security module AOM-TPM-9655V - TPM 1.2 module with Infineon 9655, RoHS/REACH,PBF;
    AOM-TPM-9655V-S - TPM 1.2 module with Infineon 9655, RoHS/REACH,PBF; Provisioned for TXT
    AOM-TPM-9665V - TPM 2.0 module with Infineon 9665, RoHS/REACH,PBF;
    AOM-TPM-9665V-S - TPM 2.0 module with Infineon 9665, RoHS/REACH,PBF; Provisioned for TXT