Key Features

• • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
  Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
  
• • Intel® C622
  
• • Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz
  Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots;
  Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
  
• • 4 PCI-E 3.0 x16,
  2 PCI-E 3.0 x8
  M.2 Interface: PCI-E 3.0 x4
  M.2 Form Factor: 2260, 2280, 22110
  M.2 Key: M-Key,
  2 PCI-E 3.0 NVMe x4 Internal Port(s)
  
• • 1 VGA port
  
• • Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  
• • Dual LAN with 10GBase-T with Intel® X722 + X557