슈퍼솔루션

슈퍼마이크로 슈퍼마이크로는 기업 컴퓨팅, 스토리지, 네트워킹 솔루션 및 그린 컴퓨팅 기술 분야의 글로벌 리더입니다.

    SYS-2029TP-HC0R

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    Key Features

    • - Compute Intensive Application
      - HPC, Data Center
      - Enterprise Server
      - Financial Analysis
      - Mission-critical applications

    • /Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
    • 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
    • 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM,
      Supports Intel® Optane™ DCPMM††
    • 3. 2 PCI-E 3.0 x16 (LP) slots
    • 4. Flexible Networking support via SIOM;
      Dedicated IPMI 2.0 LAN
    • 5. 6 Hot-swap 2.5" SAS/SATA drive bays
    • 6. Broadcom 3008 SAS3 controller;
      RAID 0, 1, 1E/10
    • 7. Mini-mSATA (half size) support on 3008 backplane
    • 8. Up to 2200W Redundant Power Supplies Titanium Level (96%)
    Specifications
    Product SKUs
    SYS-2029TP-HC0R
    • SuperServer 2029TP-HC0R (Black)
     
    Motherboard (Four per System)

    Super X11DPT-PS
     
    Processor/Cache (per Node)
    CPU
    • Dual Socket P (LGA 3647)
    • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
      Dual UPI up to 10.4GT/s
    • Support CPU TDP 70-165W*
    Cores
    • Up to 28 Cores
    Note * Please contact Supermicro Technical Support for supporting conditions of high power (TDP 150W and above) or high base frequency (3.0 GHz and above) processors.
    Note BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
     
    System Memory (per Node)
    Memory Capacity
    • 16 DIMM slots
    • Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
    • Supports Intel® Optane™ DCPMM††
    Memory Type
    • 2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
    Note 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
    †† Cascade Lake only. Contact your Supermicro sales rep for more info.
     
    On-Board Devices (per Node)
    Chipset
    • Intel® C621 chipset
    SAS
    • Broadcom 3008 SAS3 (12Gbps) controller;
         RAID 0, 1, 1E/10 support
    Network Controllers
    • Barebones and Complete System must have at least one SIOM or network card installed per node
    IPMI
    • Support for Intelligent Platform Management Interface v.2.0
    • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
    Graphics
    • ASPEED AST2500 BMC
     
    Input / Output (per Node)
    SAS
    • 6 SAS3 (12Gbps) ports
    LAN
    • 1 RJ45 Dedicated IPMI LAN port
    USB
    • 2 USB 3.0 ports (rear)
    VGA
    • 1 VGA port
    Serial Port / Header
    • 1 Fast UART 16550 port / 1 Header (internal)
    Others
    • 2 SuperDOM support on the motherboard
    • 1 NVMe or 2 SATA M.2 (22x80/60/42 mm) support with option part: AOC-SMG3-2H8M2
    • M.2 and SuperDOM are for OS boot and they cannot coexist
     
    System BIOS
    BIOS Type
    • AMI 32MB SPI Flash ROM
     
    Management
    Software
    Power Configurations
    • ACPI Power Management
     
    PC Health Monitoring
    CPU
    • Monitors for CPU Cores, Chipset Voltages, Memory.
    • 5+1 Phase-switching voltage regulator
    FAN
    • Fans with tachometer monitoring
    • Status monitor for speed control
    • Pulse Width Modulated (PWM) fan connectors
    Temperature
    • Monitoring for CPU and chassis environment
    • Thermal Control for fan connectors
    Omni-Path Fabric CPUs
    • Do not support
    Chassis
    Form Factor
    • 2U Rackmount
    Model
    • CSE-217HQ+-R2K20BP3
     
    Dimensions and Weight
    Width
    • 17.25" (438mm)
    Height
    • 3.47" (88mm)
    Depth
    • 28.5" (724mm)
    Weight
    • Gross Weight: 90 lbs (40.9kg)
    • Net Weight: 72 lbs (32.7 kg)
    Available Colors
    • Black
     
    Front Panel
    Buttons
    • Power On/Off button
    • UID button
    LEDs
    • Power status LED
    • HDD activity LED
    • Network activity LEDs
    • Universal Information (UID) LED
     
    Expansion Slots (per Node)
    PCI-Express
    • 2 PCI-E 3.0 x16 Low-profile slots
    • 1 SIOM card support

      Note: Barebones and Complete System must bundle with Network Card


    • (With only one CPU installed, SXB2 M.2 and SXB4 riser card slots not function)
     
    Drive Bays (per Node)
    Hot-swap
    • 6 Hot-swap 2.5" SAS/SATA HDD trays
     
    System Cooling
    Fans
    • 4 Heavy duty 8cm PWM fans with optimal fan speed control
     
    Power Supply
    2200W Redundant Power Supplies with PMBus
    Total Output Power and Input
    • 1200W with Input 100-127Vac
    • 1800W with Input 200-220Vac
    • 1980W with Input 220-230Vac
    • 2090W with Input 230-240Vac
    • 2200W with Input 220-240Vac (for UL/cUL use only)
    • 2090W with Input 230-240Vdc (for CCC only)
    AC Input Frequency
    • 50-60Hz
    Dimension
    (W x H x L)
    • 76 x 40 x 336 mm
    +12V
    • Max: 100A / Min: 0A (100-127Vac)
    • Max: 150A / Min: 0A (200-220Vac)
    • Max: 165A / Min: 0A (220-230Vac)
    • Max: 174.17A / Min: 0A (230-240Vac)
    • Max: 183.3A / Min: 0A (220-240Vac)
    5VSB
    • Max: 1A / Min: 0A
    Output Type
    • Backplanes (gold finger)
    Certification Titanium Level96%  Titanium Level
      [ Test Report ]
     
    Operating Environment
    RoHS
    • RoHS Compliant
    Environmental Spec.
    • Operating Temperature:
         10°C ~ 35°C (50°F ~ 95°F)
    • Non-operating Temperature:
         -40°C to 60°C (-40°F to 140°F)
    • Operating Relative Humidity:
         8% to 90% (non-condensing)
    • Non-operating Relative Humidity:
         5% to 95% (non-condensing)

    Parts List
    Parts List - (Items Included)
     
    Part Number
    Qty
    Description
    Motherboard / Chassis MBD-X11DPT-PS
    CSE-217HQ+-R2K20BP3
    4
    1
    Super X11DPT-PS Motherboards
    2U Chassis
    Backplane BPN-ADP-S3008L-L6IP 4 LSI 3008, SAS 12Gbs (X6 port inside)
    Backplane BPN-SAS3-217HQ2 1 2U 24-Port 4-Node Backplane Supports 6x2.5
    Cable 1 CBL-PWCD-0578 2 PWCD,US,IEC60320 C14 TO C13,3FT,14AWG
    Air Shroud MCP-310-21716-0B 4 Twinpro X11 air shroud
    Riser Card RSC-P-6 4 RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
    Riser Card RSC-R1UTP-E16R 4 1U RHS TwinPro Riser card with one PCI-E x16 slot
    Heatsink / Retention SNK-P0067PS 4 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
    Heatsink / Retention SNK-P0067PSM 4 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
    Power Supply PWS-2K20A-1R 2 1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm
    Optional Parts List
      Part Number Qty Description
    TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
    TPM security module (optional, not included) AOM-TPM-9671V 1 SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
    Add-on-Card AOC-SMG3-2H8M2 - AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA),
    FST-SCRW-0121L is included in AOC-SMG3-2H8M2
    Global Services & Support OS4HR3/2/1
    OSNBD3/2/1
    -
    -
    3/2/1-year onsite 24x7x4 service
    3/2/1-year onsite NBD service
    Software SFT-OOB-LIC 1 OOB Management Package (per node license)
    Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
    Hide Parts List

    서울시 금천구 벚꽃로 244 707호, 1107호~1110호, 1113호,1114호 [벽산디지털밸리5차]
    대표이사 김성현
    대표번호 : 1661-6560
    팩스번호 : 02-2082-5543
    제품 및 기술문의 : 070-4055-1414
    E-mail : sales@supersolution.co.kr