SYS-2029BZ-HNR
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Intergrated Board
Key Features
- -Compute Intensive Application
-HPC, Data Center, Enterprise Server
-Hyperscale / Hyperconverged
- Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)
- 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM††
- 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking)
Note: must bundle with Network card
- 4. 6 Hot-swap 2.5" NVMe drive bays;
2 M.2 SATA3 or NVMe support
- 5. 1 Carrier Card slot (M.2 support)
- 6. IPMI 2.0 + KVM with dedicated LAN
- 7. Video via Aspeed AST2500 BMC
- 8. 16 Heavy duty 40x56mm fans with optimal fan speed control (4 fans per node)
- 9. 2600W Redundant Power Supplies Titanium Level (96%)
Specifications
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Titanium LevelParts List
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| Parts List - (Items Included) | |||
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Part Number |
Qty |
Description |
| Motherboard / Chassis | MBD-X11DPT-BH CSE-217BHQ+-R2K60FP |
4 1 |
Super X11DPT-BH Motherboard 2U Chassis |
| Backplane | BPN-ADP-6NVME3-1UB | 4 | 6x NVMe ports and 50A power sourcing daughter card for Big Twin |
| Backplane | BPN-NVME3-217BHQ | 1 | 2U 24-Port 4-Node NVMe Backplane Support 6x2.5 |
| Cable 1 | CBL-PWCD-0376-IS | 2 | PWCD,US,IEC60320 C19 TO C20,940mm (3ft),14AWG,15A,250V,Black |
| Drive Tray(s) | MCP-220-00127-0B-BULK | 24 | Black gen3 Hotswap 2.5 NVMe drive tray, Orange tab/Lock/Bulk |
| Air Shroud | MCP-310-21719-0B | 4 | Bigtwin mylar air shroud for X11DPT-BH (4CM fan chassis) |
| Air Shroud | MCP-310-21720-0B | 4 | Bigtwin plastic air shroud for X11DPT-BH (4CM fan chassis) |
| Manual | MNL-2126-QRG | 1 | 2029BZ-HNR Quick Reference Guide |
| Riser Card | RSC-P-6 | 4 | RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS |
| Riser Card | RSC-R1UTP-E16R | 4 | 1U RHS TwinPro Riser card with one PCI-E x16 slot |
| Heatsink / Retention | SNK-P0067PSMB | 4 | 1U Passive High Performance Front CPU Heat Sink w/ an 18-mm Wide Middle Air Channel for X11 Purley Platform Equipped w/ a Narrow Retention Mechanism/Bolster |
| Heatsink / Retention | SNK-P0071VS | 4 | 1U Proprietary Passive CPU Heat Sink (124 mm Long) for SYS-2029BZ-HNR Series Servers (X11 2U4N 3UPI Big Twin) |
| Power Supply | PWS-2K60A-1R | 2 | 1U 2600W Redundant Titanium PWS, 45(W) X 40(H) X 480(L) |
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| Optional Parts List | |||
| Part Number | Qty | Description | |
| TPM security module | AOM-TPM-9670H | 1 | SPI capable TPM 2.0 with Infineon 9670 controller, Horizontal form factor |
| TPM security module | AOM-TPM-9671H | 1 | SPI capable TPM 1.2 with Infineon 9670 controller, Horizontal form factor |
| Intel VROC RAID Key | AOC-VROCINTMOD AOC-VROCSTNMOD AOC-VROCPREMOD |
1 1 1 |
Intel VROC, RAID 0, 1, 5, 10 (Intel SSD Only) Intel VROC Standard, RAID 0, 1, 10 Intel VROC Premium, RAID 0, 1, 5, 10 |
| Global Services & Support | OS4HR3/2/1 OSNBD3/2/1 |
- - |
3/2/1-year onsite 24x7x4 service 3/2/1-year onsite NBD service |
| Software | SFT-OOB-LIC | 1 | OOB Management Package (per node license) |
| Software | SFT-DCMS-Single | 1 | DataCenter Management Package (per node license) |
| SuperDOM | - | - | Supermicro SATA DOM Solutions [Details] |
| Network Card(s) |
AOC-S40G-i2Q AOC-SGP-i2 AOC-SGP-i4 AOC-STG-b4S AOC-STGN-i2S AOC-STGN-i1S AOC-STG-i2T AOC-STG-i2 |
- - - - - - - - |
Standard LP 2-port 40GbE controller, based on Intel Fortville XL710 Standard LP, 2x GbE RJ45, PCI-E x4, Intel i350AM2 Standard LP, 4x GbE RJ45, PCI-E x4, Intel i350 Standard LP, 4x 10GbE SFP+, PCI-E x8, Broadcom BCM57840S Standard LP, 2x 10GbE SFP+, PCI-E x8, Intel 82599ES Standard LP, 1x 10GbE SFP+, PCI-E x8, Intel 82599EN Standard LP, 2x 10GbE RJ45, PCI-E x8, Intel X540 Standard LP, 2x 10GbE CX4, PCI-E x8, Intel 82598EB |
| Carrier Card(s) |
AOC-SMG3-2H8M2-B AOC-SMG2-2TM2 |
- - |
2x Hybrid NVMe/SATA M.2 carrier for BigTwin,HF,RoHS 2x SATA M.2 RAID 1 adapter for BigTwin,HF,RoHS |
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